中文 EN
189-2464-6170
szjhpcb@VIP.126.com

7×24 Engineer One-on-One Technical Support

中文 EN

ZeroDefect Manufacturing Guards Core Innovation

PCB fabrication, component procurement, SMT assembly, DIP soldering, burn-in testing, finished product assembly - one-stop PCBA service

Custom from Drawings/Samples Consult Engineer Now

Core Business

Over 10 years of circuit board technology and full-process manufacturing experience. From PCB fabrication, SMT assembly, component procurement to complete testing, our one-stop PCBA service empowers global innovation with zero-defect quality.

One-Stop Service, Hassle-Free

PCBA Turnkey

One-Stop Hardcore Manufacturing Solution

  • PCB+SMT+DIP full process, one order, unified delivery
  • Professional DFM reliability analysis by senior engineers
  • BOM centralized procurement, factory-original materials
  • Imported equipment + 9-layer quality control, high-precision PCBA manufacturing
  • Fully controllable and traceable production, zero-defect delivery with continuous improvement
  • Prototype to small/medium batch
Inquire Now
24H Rush Prototyping, 8H Shipment

PCB Fabrication

PCB Copy & PrototypingCustom from Drawings/Samples

  • High-precision multi-layer specialty boards
  • HDI blind/buried via boards
  • Flexible FPC / Rigid-Flex boards
  • Aluminum/Copper/Heavy Copper boards
  • High-frequency Rogers/PTFE boards
  • Heavy Copper / Gold Finger boards
Inquire Now
Precision Assembly, 99.8% Yield

SMT Assembly

Factory-Original Materials, Precision Assembly

  • Double-sided, through-hole, odd-form components
  • Rigorous production with 9-layer quality control
  • Fully automatic printing & reflow soldering
  • High-speed pick-and-place: 01005, 0201 to BGA ultra-precision
  • AOI optical inspection & X-Ray inspection
  • Small & large volume runs available
Inquire Now

Customer Cases

10+ years of industry experience, meeting diversePCBA Customrequirements, from prototyping to mass production, monthly capacity exceeds 6,000 types / 96 million placements, 98% customer satisfaction & retention

Latest Custom Projects

Medical ScannerPCBA Assembly

Technical Challenges

ISO 13485 certified, strong anti-interference capability, long-term stability required

Solution

  • 4-layer impedance-controlled board design, ±5% impedance tolerance
  • Special anti-interference and shielding treatment
  • Medical-grade materials, FDA compliant
  • Complete traceability system
Customize Now

Smart ControllerPCBA Assembly

Technical Challenges

Dense functional modules, multiple control signals, requires anti-interference and stable batch delivery

Solution

  • Multiple power domain isolation and critical signal shielding
  • BOM substitute risk reviewed in advance
  • AOI, X-RAY, FCT multi-layer inspection
  • Full-process batch traceability records
Customize Now

Medical equipment​SMT/PCBA Assembly

Medical-grade PCBA with micro-component placement (01005/0201, BGA/QFP/QFN). Compliant with ISO 13485 & IPC-A-610 Class 3. Cleanroom production, full inspection (3D SPI/AOI, X-Ray, ICT/FCT), MES traceability. Reliable solutions for medical devices—from prototyping to low-volume production.

Case Center

View More
More+ Order Now

PCB Fabrication Services

From single-layer to multi-layer, HDI blind/buried to transparent, and flexible to rigid PCBs—we cover the entire electronics manufacturing spectrum, specializing in custom solutions for High Multi-Layer, high-precision, high-complexity, and high-reliability boards.

Rush Prototyping 8H Shipment

High Multi-Layer

4-26 Layers Custom

  • Ultra-thick Gold 100u"
  • Custom Lamination/ Hybrid Structure
  • Multi-Impedance / Min. Aperture 0.1mm
  • Min. Line 35um/1.4mil
  • Registration ±12um
  • Overlay Accuracy ≤25um
Inquire Now
R&D / Small-Medium 6-Day

HDI

1-5 Stages, Any Stage

  • High Tg ≥170℃
  • Laser Drill/Plated Via Fill
  • 2/2mil Line Width
  • Special: Back Drill, Cap
Inquire Now
Standard Proto Fastest 24H

Rigid-Flex / FPC

1-16 Layers

  • Laser/Blind-Buried/HDI Process
  • 0.05/0.05mmLine Width/Spacing
  • 100% E-test Before Shipment
  • ISO 9001, ISO 13485 Certified
Inquire Now
Grade-A Material 99.8% Yield

High-Freq/High-Speed

Pure/Hybrid 4-16L, PTFE, BT Substrate

  • Rogers/Taiyao/Isola
  • Plasma Desmear Process
  • Low Dk/Low Df Material
  • Asymmetric/Heterogeneous Hybrid
Inquire Now
High Thermal, Hotspot Isolation

Metal Core Board

1-8 Layers

  • Double/Multi-Layer Al/Cu Core
  • Copper: 0.5oz-6oz
  • Min. Aperture：0.80mm（混压min0.30mm）
  • LF HASL, HASL, ENIG, OSP, etc.
Inquire Now

Product Display

High Multilayer HDI Blind Rigid-Flex High Freq/Speed Metal Core Special PCBs

High Multilayer PCB Boards

View More

Our advanced multilayer PCBs (4+ layers) deliver higher wiring density, superior signal integrity, and reduced EMI risks. Backed by Juehui's 10+ years of expertise in high-layer precision manufacturing, we seamlessly integrate rapid prototyping with mass production. This provides stable and reliable core support for highly complex systems, including medical equipment, industrial motherboards, AI servers, and 5G base stations.

22‑Layer 2‑Stage HDI PCB with Laser Drilling

22‑Layer 2‑Stage HDI PCB with Laser Drilling

Layers：22-Layer Line Width/Spacing：3/3mil Material：FR-4 Surface Finish: Thickness：2.8mm Application：AI High‑Speed Server

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

Layers：10-Layer Line Width/Spacing：3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Aviation Navigation

8‑Layer High‑Speed Signal Main Controller PCB

8‑Layer High‑Speed Signal Main Controller PCB

Layers： Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: HASL‑Lead‑Free Thickness：1.6mm Application：Network Communication

10‑Layer Halogen‑Free High‑Speed Communication PCB

10‑Layer Halogen‑Free High‑Speed Communication PCB

Layers：10-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.6mm Application：Automotive

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

Layers：12-Layer Line Width/Spacing：2/3mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：High‑Speed Communication

12-Layer High-End Medical Main Control PCB

12-Layer High-End Medical Main Control PCB

Layers：12-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：High-Frequency Data PCB

8-Layer Heavy Copper Substrate with Conductive Copper Paste Plugged Vias

8-Layer Heavy Copper Substrate with Conductive Copper Paste Plugged Vias

Layers：8-Layer Line Width/Spacing：5mil Material：FR-4 Surface Finish: ENIG Thickness：3.2mm Application：BMS Balancing Main Controller

8-Layer 3OZ Heavy Copper PCB

8-Layer 3OZ Heavy Copper PCB

Layers：8-Layer Line Width/Spacing：5mil Material：FR-4 Surface Finish: ENIG Thickness：2.6mm Application：Energy Storage Power Supply

6-Layer Shengyi PCB for Server Storage

6-Layer Shengyi PCB for Server Storage

Layers：6-Layer Line Width/Spacing：6/5mil Material：Shengyi S1000-H Surface Finish: OSP+ENIG Thickness：1.6mm Application：Server & Storage

12-Layer Industrial Control High-Speed Communication PCB

12-Layer Industrial Control High-Speed Communication PCB

Layers：12-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: Thickness：2.0mm Application：Industrial Control & Communication

12-Layer High-Density Automotive High-Speed PCB

12-Layer High-Density Automotive High-Speed PCB

Layers：12-Layer Line Width/Spacing：3/2mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

Layers：6-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：8-Layer Line Width/Spacing：6/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Premium Intelligent Control

6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：6-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG Thickness：2.4mm Application：Industrial Robot

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

Layers：6-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Ethernet

10-Layer 1-Stage HDI High-Speed PCB

10-Layer 1-Stage HDI High-Speed PCB

Layers：10-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Servo Drive

6-Layer 1-Stage HDI PCB with Mechanical Drilling

6-Layer 1-Stage HDI PCB with Mechanical Drilling

Layers：6-Layer Line Width/Spacing：9/9mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Energy Storage System

8-Layer PCB with Half Holes on Four Sides

8-Layer PCB with Half Holes on Four Sides

Layers：8-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.2mm Application：Edge Computing

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

Layers：4-Layer Line Width/Spacing：10/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Implantable Medical Devices

HDI High-Density Interconnect PCB with Resin Plugged Vias

HDI High-Density Interconnect PCB with Resin Plugged Vias

Layers：4-Layer Line Width/Spacing：8/6mil Material：FR-4 Surface Finish: HASL Thickness：1.6mm Application：Industrial Multi-IO Control Board

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

Layers：6-Layer Line Width/Spacing：5/3mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Industrial AI Vision

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

Layers：8-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Smart Card Reading Access Control

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

Layers：6-Layer Line Width/Spacing：0.4/3mil Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.0mm Application：Portable Medical Devices

6-Layer Mechanical Blind HDI PCB Rapid Prototyping

6-Layer Mechanical Blind HDI PCB Rapid Prototyping

Layers：6-Layer Line Width/Spacing：7/7mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Power Mainboard

12-Layer Industrial Control PCB Prototype

12-Layer Industrial Control PCB Prototype

Layers：12-Layer Line Width/Spacing：6/3mil Material：FR-4 Surface Finish: HASL Thickness：3.0mm Application：Multi-channel Solenoid Valve Board

4-Layer FR-4 PCB Custom Fabrication

4-Layer FR-4 PCB Custom Fabrication

Layers：4-Layer Line Width/Spacing：8/3mil Material：FR-4 Surface Finish: ENEPIG Thickness：5.0mm Application：Optoelectronics Industry

12-Layer High-Speed PCB for Automotive Applications

12-Layer High-Speed PCB for Automotive Applications

Layers：12-Layer Line Width/Spacing：3/2mil Material：TU872 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics

14-Layer High Frequency PCB with Taiyao Material

14-Layer High Frequency PCB with Taiyao Material

Layers：14-Layer Line Width/Spacing：4/2mil Material：TU872 Surface Finish: ENIG,2U” Thickness：2.0mm Application：Automotive Electronics

22‑Layer 2‑Stage HDI PCB with Laser Drilling

22‑Layer 2‑Stage HDI PCB with Laser Drilling

Layers：22-Layer Line Width/Spacing：3/3mil Material：FR-4 Surface Finish: Thickness：2.8mm Application：AI High‑Speed Server

0.4mm Thin‑Profile PCB with Laser Buried & Blind Vias

0.4mm Thin‑Profile PCB with Laser Buried & Blind Vias

Layers：4-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: Thickness：0.4mm Application：Fingerprint & Facial Recognition

High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

Layers：8-Layer Line Width/Spacing：0.075mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：High-Speed Communication

Smart Wearable HDI RF Rigid-Flex PCB

Smart Wearable HDI RF Rigid-Flex PCB

Layers：4-Layer Line Width/Spacing：3.5mil Material：PP+PI Surface Finish: ENIG Thickness：0.15mm Application：Smart Wearables

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

Layers：6-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：8-Layer Line Width/Spacing：6/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Premium Intelligent Control

6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：6-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG Thickness：2.4mm Application：Industrial Robot

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

Layers：6-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Ethernet

10-Layer 1-Stage HDI High-Speed PCB

10-Layer 1-Stage HDI High-Speed PCB

Layers：10-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Servo Drive

6-Layer 1-Stage HDI PCB with Mechanical Drilling

6-Layer 1-Stage HDI PCB with Mechanical Drilling

Layers：6-Layer Line Width/Spacing：9/9mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Energy Storage System

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

Layers：4-Layer Line Width/Spacing：10/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Implantable Medical Devices

HDI High-Density Interconnect PCB with Resin Plugged Vias

HDI High-Density Interconnect PCB with Resin Plugged Vias

Layers：4-Layer Line Width/Spacing：8/6mil Material：FR-4 Surface Finish: HASL Thickness：1.6mm Application：Industrial Multi-IO Control Board

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

Layers：6-Layer Line Width/Spacing：5/3mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Industrial AI Vision

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

Layers：8-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Smart Card Reading Access Control

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

Layers：6-Layer Line Width/Spacing：0.4/3mil Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.0mm Application：Portable Medical Devices

6-Layer Mechanical Blind HDI PCB Rapid Prototyping

6-Layer Mechanical Blind HDI PCB Rapid Prototyping

Layers：6-Layer Line Width/Spacing：7/7mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Power Mainboard

Panelized Rigid-Flex PCB

Panelized Rigid-Flex PCB

Layers：8-Layer Line Width/Spacing：3/3mil Material：PP+PI Surface Finish: ENIG Thickness：0.12mm Application：Patient Monitor

Export Rigid-Flex PCB for National Defense Communication Equipment

Export Rigid-Flex PCB for National Defense Communication Equipment

Layers： Line Width/Spacing：4/4mil Material：PP+PI Surface Finish: Electroplated Hard Gold Thickness：0.15mm Application：Aerospace & Defense

Rigid-Flex PCB for Medical Ultrasound Probes

Rigid-Flex PCB for Medical Ultrasound Probes

Layers：4-Layer Line Width/Spacing：3/3mil Material：PP+PI Surface Finish: Thickness：0.15mm Application：Ultrasound Probe

Rigid-Flex PCB for Medical Rotary Modules

Rigid-Flex PCB for Medical Rotary Modules

Layers：6-Layer Line Width/Spacing：3/3mil Material：FR-4/PI Surface Finish: ENIG + Electroplated Hard Gold Thickness：0.12mm Application：Precision Motion Control

High-Temperature Resistant PI ENIG Rigid-Flex PCB

High-Temperature Resistant PI ENIG Rigid-Flex PCB

Layers：2-Layer Line Width/Spacing：6/4mil Material：PI Surface Finish: ENIG Thickness：0.14mm Application：Medical

Rigid-Flex PCB for Smart Wearable Modules

Rigid-Flex PCB for Smart Wearable Modules

Layers：4-Layer Line Width/Spacing：4/2mil Material：PP+PI Surface Finish: ENIG Thickness：1.0mm Application：Smart Wearables

Smart Wearable HDI RF Rigid-Flex PCB

Smart Wearable HDI RF Rigid-Flex PCB

Layers：4-Layer Line Width/Spacing：3.5mil Material：PP+PI Surface Finish: ENIG Thickness：0.15mm Application：Smart Wearables

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

Layers：6-Layer Line Width/Spacing：5/3mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Industrial AI Vision

22‑Layer 2‑Stage HDI PCB with Laser Drilling

22‑Layer 2‑Stage HDI PCB with Laser Drilling

Layers：22-Layer Line Width/Spacing：3/3mil Material：FR-4 Surface Finish: Thickness：2.8mm Application：AI High‑Speed Server

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

Layers：10-Layer Line Width/Spacing：3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Aviation Navigation

8‑Layer High‑Speed Signal Main Controller PCB

8‑Layer High‑Speed Signal Main Controller PCB

Layers： Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: HASL‑Lead‑Free Thickness：1.6mm Application：Network Communication

10‑Layer Halogen‑Free High‑Speed Communication PCB

10‑Layer Halogen‑Free High‑Speed Communication PCB

Layers：10-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.6mm Application：Automotive

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

Layers：12-Layer Line Width/Spacing：2/3mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：High‑Speed Communication

5G Communication Multi‑RF PCB Circuit Board

5G Communication Multi‑RF PCB Circuit Board

Layers：8-Layer Line Width/Spacing：3/3mil Material：FR-4 Surface Finish: ENIG Thickness：0.8mm Application：5G Communication

High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

Layers：8-Layer Line Width/Spacing：0.075mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：High-Speed Communication

12-Layer High-End Medical Main Control PCB

12-Layer High-End Medical Main Control PCB

Layers：12-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：High-Frequency Data PCB

High Frequency RF Signal Copper Substrate PCB

High Frequency RF Signal Copper Substrate PCB

Layers：2-Layer Line Width/Spacing：4.5mil Material：FR-4 Surface Finish: Thickness：0.8mm Application：RF & Microwave

6-Layer Shengyi PCB for Server Storage

6-Layer Shengyi PCB for Server Storage

Layers：6-Layer Line Width/Spacing：6/5mil Material：Shengyi S1000-H Surface Finish: OSP+ENIG Thickness：1.6mm Application：Server & Storage

12-Layer Industrial Control High-Speed Communication PCB

12-Layer Industrial Control High-Speed Communication PCB

Layers：12-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: Thickness：2.0mm Application：Industrial Control & Communication

12-Layer High-Density Automotive High-Speed PCB

12-Layer High-Density Automotive High-Speed PCB

Layers：12-Layer Line Width/Spacing：3/2mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

Layers：6-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：8-Layer Line Width/Spacing：6/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Premium Intelligent Control

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

Layers：6-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Ethernet

10-Layer 1-Stage HDI High-Speed PCB

10-Layer 1-Stage HDI High-Speed PCB

Layers：10-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Servo Drive

8-Layer PCB with Half Holes on Four Sides

8-Layer PCB with Half Holes on Four Sides

Layers：8-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.2mm Application：Edge Computing

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

Layers：4-Layer Line Width/Spacing：10/3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Implantable Medical Devices

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

Layers：8-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Smart Card Reading Access Control

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

Layers：6-Layer Line Width/Spacing：0.4/3mil Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.0mm Application：Portable Medical Devices

PCB fabricated with SH260 high-temperature substrate

PCB fabricated with SH260 high-temperature substrate

Layers：2-Layer Line Width/Spacing：6/6mil Material：SH260 Surface Finish: ENIG Thickness：2.0mm Application：Semiconductor

12-Layer High-Speed PCB for Automotive Applications

12-Layer High-Speed PCB for Automotive Applications

Layers：12-Layer Line Width/Spacing：3/2mil Material：TU872 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics

14-Layer High Frequency PCB with Taiyao Material

14-Layer High Frequency PCB with Taiyao Material

Layers：14-Layer Line Width/Spacing：4/2mil Material：TU872 Surface Finish: ENIG,2U” Thickness：2.0mm Application：Automotive Electronics

Industrial High Power 8oz Heavy Copper PCB

Industrial High Power 8oz Heavy Copper PCB

Layers：2-Layer Line Width/Spacing：3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：High-Power Power Supply

8-Layer Heavy Copper Substrate with Conductive Copper Paste Plugged Vias

8-Layer Heavy Copper Substrate with Conductive Copper Paste Plugged Vias

Layers：8-Layer Line Width/Spacing：5mil Material：FR-4 Surface Finish: ENIG Thickness：3.2mm Application：BMS Balancing Main Controller

High Frequency RF Signal Copper Substrate PCB

High Frequency RF Signal Copper Substrate PCB

Layers：2-Layer Line Width/Spacing：4.5mil Material：FR-4 Surface Finish: Thickness：0.8mm Application：RF & Microwave

COB Aluminum Substrate for Smart Home Lighting Board

COB Aluminum Substrate for Smart Home Lighting Board

Layers：4-Layer Line Width/Spacing：4/4mil Material：Aluminum PCB Surface Finish: HASL Thickness：1.0mm Application：Smart Home Lighting

8-Layer 3OZ Heavy Copper PCB

8-Layer 3OZ Heavy Copper PCB

Layers：8-Layer Line Width/Spacing：5mil Material：FR-4 Surface Finish: ENIG Thickness：2.6mm Application：Energy Storage Power Supply

10‑Layer Halogen‑Free High‑Speed Communication PCB

10‑Layer Halogen‑Free High‑Speed Communication PCB

Layers：10-Layer Line Width/Spacing：3.5mil Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.6mm Application：Automotive

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

Layers：12-Layer Line Width/Spacing：2/3mil Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：High‑Speed Communication

2OZ Heavy Copper PCB with Full‑Board Electroplated Gold

2OZ Heavy Copper PCB with Full‑Board Electroplated Gold

Layers：2-Layer Line Width/Spacing：5mil Material：FR-4 Surface Finish: Full‑Area Electroplated Gold 3μ" Thickness：0.4mm Application：Wireless Microphone

0.6mm High‑Density Thin‑Core PCB with Thick Gold Plating

0.6mm High‑Density Thin‑Core PCB with Thick Gold Plating

Layers：2-Layer Line Width/Spacing：5/5mil Material：FR-4 Surface Finish: Selective Electroplated Gold 4μm Thickness：0.6mm Application：Miniature Digital Products

0.2mm Ultra‑Thin PCB with Resin Plugged Vias

0.2mm Ultra‑Thin PCB with Resin Plugged Vias

Layers：2-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: ENIG Thickness：0.2mm Application：Bluetooth Earbuds

0.4mm Thin‑Profile PCB with Laser Buried & Blind Vias

0.4mm Thin‑Profile PCB with Laser Buried & Blind Vias

Layers：4-Layer Line Width/Spacing：4/3mil Material：FR-4 Surface Finish: Thickness：0.4mm Application：Fingerprint & Facial Recognition

PCB with Depth-Controlled Slots & Holes and Selective Thick Electroless Gold Plating

PCB with Depth-Controlled Slots & Holes and Selective Thick Electroless Gold Plating

Layers：2-Laye Line Width/Spacing：4mil Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：Touch Panel

Industrial Thick PCB with 0.5mm Small Slots

Industrial Thick PCB with 0.5mm Small Slots

Layers： Line Width/Spacing： Material：FR-4 Surface Finish: ENIG,2U” Thickness：3.2mm Application：Test Fixture Industry

Selective ENIG & HASL PCB for Consumer Electronics

Selective ENIG & HASL PCB for Consumer Electronics

Layers：2-Layer Line Width/Spacing： Material：FR-4 Surface Finish: HASL+ENIG Thickness：1.6mm Application：Consumer Electronics

Industrial High Power 8oz Heavy Copper PCB

Industrial High Power 8oz Heavy Copper PCB

Layers：2-Layer Line Width/Spacing：3mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：High-Power Power Supply

Laser Sensing Transparent PCB

Laser Sensing Transparent PCB

Layers： Line Width/Spacing：5/2.5mil Material：Available Substrate Materials Surface Finish: ENIG Thickness：1.0mm Application：Chip Test Fixture

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

Layers：6-Layer Line Width/Spacing：6/4mil Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control

6-Layer 1-Stage HDI PCB with Mechanical Drilling

6-Layer 1-Stage HDI PCB with Mechanical Drilling

Layers：6-Layer Line Width/Spacing：9/9mil Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Energy Storage System

4-Layer FR-4 PCB Custom Fabrication

4-Layer FR-4 PCB Custom Fabrication

Layers：4-Layer Line Width/Spacing：8/3mil Material：FR-4 Surface Finish: ENEPIG Thickness：5.0mm Application：Optoelectronics Industry

More+ Order Now

"Zero Defect" Manufacturing

Providing Truly Reliable PCB & PCBA Products

Grade-A Materials
ISO Certified
One-on-One Service
Fast 8-Hour Delivery

Quick Quote

Please fill in "Phone" before submitting

24H Hotline 189-2464-6170 is always here for you!
PCB Quote

Submitted Successfully

Our engineer will contact you at within 2 hours. Please keep your phone available!
189-2464-6170
24H Hotline - Always at Your Service Your information is secure and used for business only.

PCBA Custom

Upload compressed project files. Precise quote within 2 hours by phone.

Gerber file formats:

Gerber、CAM350、Protel、PADS Layout、PowerPCB、Cadencs
.zip .rar .pcb .gbr .cam .brd

CPL & BOM file formats:

.xls .xlsx .csv .rar

Your information is secure and used for business only.

PCB Quote

Upload Gerber files. Free DFM analysis. Precise quote within 2 hours.

Supported file formats:

Gerber、CAM350、Protel、PADS Layout、PowerPCB、Cadencs
.zip .rar .pcb .gbr .cam .brd

Your information is secure and used for business only.