12-Layer High-End Medical Main Control PCB

12-Layer High Multilayer Structure

Sufficient routing space supports high-density traces, accommodates dense BGA packages, and enables high integration of complex high-speed circuits.

1.6mm Standard Board Thickness

Moderate rigidity and excellent flatness, compatible with automated SMT mounting and reflow soldering processes.

ENIG Surface Finish

Flat pads with oxidation resistance ensure reliable soldering for precision components such as BGA and QFN, and allow long-term storage.

Versatile FR-4 Substrate

Stable temperature resistance and balanced cost performance. Controlled impedance customization is available to match high-speed signals.

Mature Multilayer Lamination Technology

Excellent registration control between layers; low risk of delamination and voids for high reliability.

Customizable Mechanical Features

Custom hole sizes, routing slots and fiducial mounting holes are supported to match complete device assembly structures.

Compliance Certifications

UL and RoHS compliant, meeting regulatory requirements for domestic and overseas sales.