Industrial High Power 8oz Heavy Copper PCB

8oz Extra Heavy Copper with Ultra-High Current Carrying Capacity

Copper weight far exceeds conventional 1~2oz copper foil. Featuring large cross-sectional area, low voltage drop and low heat generation, it supports hundreds of amperes and is ideal for high-power circuits.

Double-Sided Etching with Controllable Circuit Precision

Custom etching parameters are deployed to mitigate undercutting common in heavy copper boards. Consistent trace width prevents insufficient current capacity and localized overheating that causes board burnout.

Double-Sided 8oz Copper Layers for Enhanced Heat Dissipation via Dual Current Paths

Both top and bottom layers can route high-current circuits. The enlarged copper coverage area delivers superior thermal dissipation, resulting in lower temperature rise during prolonged full-load operation and significantly improved reliability.

ENIG Finish on Pads for Stable High-Current Soldering

Power terminals and component pads adopt electroless nickel immersion gold (ENIG). The surface resists oxidation and tarnishing and allows repeated rework soldering. It provides strong adhesion for connectors and cable lugs, avoiding cold solder joints and thermal overloading.

Specialized Heavy Copper Laminate Resists Warpage & Delamination

Substrate and resin systems are engineered to accommodate heavy copper thermal stress. No copper lifting, peeling or delamination occurs during reflow soldering or long-term high-temperature operation.

Special-Shaped Oblong Holes Optimized for Terminal Assembly

Predefined high-current oblong holes and large mounting holes facilitate secure fastening of cable lugs and copper terminals, meeting wiring requirements of industrial high-power equipment.