PCB with Depth-Controlled Slots & Holes and Selective Thick Electroless Gold Plating

3.0mm Extra-Thick Double-Layer Structure

High mechanical strength and excellent flatness. As a panel substrate, it resists deformation, ideal for exposed key assembly with strong resistance to pressing fatigue.

Resin Plugged Vias

Smooth filling inside vias prevents solder trapping and voids during SMT soldering, improving mass assembly yield and avoiding circuit corrosion caused by moisture ingress into holes.

Precision Depth-Controlled Holes & Slots

Accurate depth control for single-layer routing and drilling. It enables structural clearance, layer isolation and assembly positioning without damaging insulation of underlying circuits.

Selective Thick Electroless Gold Plating

Gold thickness is increased only on key contact pads to deliver wear resistance, oxidation resistance and stable conductivity under repeated pressing. Gold plating is omitted on other areas to reduce costs for better cost performance.

Abrasion-Resistant Thickened Gold Layer

Resists oxidation and discoloration after long-term frequent pressing, maintaining consistent tactile feel and stable electrical performance over time.

Special-Shaped Large Window Cutouts

Designed to fit screen installation. The overall structure offers great compatibility with housing assembly.

High Insulation Reliability

Complete insulation remains on inner walls of depth-controlled slots, minimizing risks of leakage and short circuits under high-low temperature and humid conditions.