8-Layer 3OZ Heavy Copper PCB

8-Layer High-Layer Structure: Partitioned layout of power layers, signal layers and ground planes isolates strong and weak electricity with strong anti-interference performance and high circuit integration.

Advantages of Heavy Copper Design: Thickened copper foil carries ultra-high current, reduces trace heat generation and voltage drop, suitable for high-power power supply applications.

Conductive Copper Paste Plugged Vias: Vertical conductive interconnection through vias shortens conduction paths and reduces internal resistance to improve high-current carrying capacity. It replaces conventional rivet and buried via solutions for higher space utilization.

2.6mm Increased Board Thickness: High structural rigidity and deformation resistance, ideal for mounting and heat dissipation assembly of high-power components.

Black Solder Mask + ENIG Surface Finish: Neat appearance conducive to heat dissipation; pads feature oxidation and corrosion resistance, ensuring stable performance during repeated component soldering and rework.

High Tg High-Temperature Resistant Laminate: Resists delamination and blistering under long-term high-current heating, delivering reliability for harsh new energy operating conditions.