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High Freq/SpeedPCB Boards

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Juehui over 10 years of high-layer precision PCB technology, focusing on High Freq/Speed PCB R&D and manufacturing. High wiring density, strong signal integrity and low-loss characteristics, meeting mass production and prototyping needs for complex systems including medical devices, industrial control boards, automotive electronics and communication terminals.

22‑Layer 2‑Stage HDI PCB with Laser Drilling

22‑Layer 2‑Stage HDI PCB with Laser Drilling

Layers:22-Layer Line Width/Spacing:0.076mm Material:FR-4 Surface Finish: Thickness:2.8mm Application:AI High‑Speed Server

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

Layers:10-Layer Line Width/Spacing:0.07mm Material:FR-4 Surface Finish: ENIG Thickness:1.6mm Application:Aviation Navigation

8‑Layer High‑Speed Signal Main Controller PCB

8‑Layer High‑Speed Signal Main Controller PCB

Layers: Line Width/Spacing:0.09mm Material:FR-4 Surface Finish: HASL‑Lead‑Free Thickness:1.6mm Application:Network Communication

10‑Layer Halogen‑Free High‑Speed Communication PCB

10‑Layer Halogen‑Free High‑Speed Communication PCB

Layers:10-Layer Line Width/Spacing:0.1mm Material:FR-4 Surface Finish: ENIG 2U" Thickness:1.6mm Application:Automotive

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

Layers:12-Layer Line Width/Spacing:0.067mm Material:FR-4 Surface Finish: ENIG Thickness:2.0mm Application:High‑Speed Communication

5G Communication Multi‑RF PCB Circuit Board

5G Communication Multi‑RF PCB Circuit Board

Layers:8-Layer Line Width/Spacing:0.075mm Material:FR-4 Surface Finish: ENIG Thickness:0.8mm Application:5G Communication

High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

Layers:8-Layer Line Width/Spacing:0.075mm Material:FR-4 Surface Finish: ENIG Thickness:1.0mm Application:High-Speed Communication

12-Layer High-End Medical Main Control PCB

12-Layer High-End Medical Main Control PCB

Layers:12-Layer Line Width/Spacing:0.11mm Material:FR-4 Surface Finish: ENIG Thickness:1.6mm Application:High-Frequency Data PCB

High Frequency RF Signal Copper Substrate PCB

High Frequency RF Signal Copper Substrate PCB

Layers:2-Layer Line Width/Spacing:0.12mm Material:FR-4 Surface Finish: Thickness:0.8mm Application:RF & Microwave

6-Layer Shengyi PCB for Server Storage

6-Layer Shengyi PCB for Server Storage

Layers:6-Layer Line Width/Spacing:0.152mm Material:Shengyi S1000-H Surface Finish: OSP+ENIG Thickness:1.6mm Application:Server & Storage

12-Layer Industrial Control High-Speed Communication PCB

12-Layer Industrial Control High-Speed Communication PCB

Layers:12-Layer Line Width/Spacing:0.11mm Material:FR-4 Surface Finish: Thickness:2.0mm Application:Industrial Control & Communication

12-Layer High-Density Automotive High-Speed PCB

12-Layer High-Density Automotive High-Speed PCB

Layers:12-Layer Line Width/Spacing:0.08mm Material:FR-4 Surface Finish: ENIG Thickness:2.0mm Application:Automotive Electronics

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

Layers:6-Layer Line Width/Spacing:0.15mm Material:FR-4 Surface Finish: ENIG Thickness:3.0mm Application:High-End Industrial Measurement & Control

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers:8-Layer Line Width/Spacing:0.12mm Material:FR-4 Surface Finish: ENIG Thickness:1.6mm Application:Premium Intelligent Control

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

Layers:6-Layer Line Width/Spacing:0.095mm Material:FR-4 Surface Finish: ENIG Thickness:1.6mm Application:Industrial Ethernet

10-Layer 1-Stage HDI High-Speed PCB

10-Layer 1-Stage HDI High-Speed PCB

Layers:10-Layer Line Width/Spacing:0.15mm Material:FR-4 Surface Finish: ENIG Thickness:1.6mm Application:Industrial Servo Drive

8-Layer PCB with Half Holes on Four Sides

8-Layer PCB with Half Holes on Four Sides

Layers:8-Layer Line Width/Spacing:0.1mm Material:FR-4 Surface Finish: ENIG Thickness:1.2mm Application:Edge Computing

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

Layers:4-Layer Line Width/Spacing:0.23mm Material:FR-4 Surface Finish: ENIG Thickness:1.6mm Application:Implantable Medical Devices

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

Layers:8-Layer Line Width/Spacing:0.145mm Material:FR-4 Surface Finish: ENIG Thickness:1.0mm Application:Smart Card Reading Access Control

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

Layers:6-Layer Line Width/Spacing:0.01mm Material:FR-4 Surface Finish: ENIG 2U" Thickness:1.0mm Application:Portable Medical Devices

PCB fabricated with SH260 high-temperature substrate

PCB fabricated with SH260 high-temperature substrate

Layers:2-Layer Line Width/Spacing:0.15mm Material:SH260 Surface Finish: ENIG Thickness:2.0mm Application:Semiconductor

12-Layer High-Speed PCB for Automotive Applications

12-Layer High-Speed PCB for Automotive Applications

Layers:12-Layer Line Width/Spacing:0.08mm Material:TU872 Surface Finish: ENIG Thickness:2.0mm Application:Automotive Electronics

14-Layer High Frequency PCB with Taiyao Material

14-Layer High Frequency PCB with Taiyao Material

Layers:14-Layer Line Width/Spacing:0.11mm Material:TU872 Surface Finish: ENIG,2U” Thickness:2.0mm Application:Automotive Electronics

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