High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB

HDI High-Density Routing with Ultra-High Space Utilization

The blind and buried via structure frees up surface space. Fine traces enable fan-out for tiny BGAs, supporting layout of complex multi-pin main controller chips and reducing overall product size.

Precise High-Speed Impedance Control for Excellent Signal Integrity

Low-loss resin combined with sophisticated manufacturing processes ensures tight tolerance for differential and single-ended impedance. High-speed signals feature low loss and strong anti-crosstalk performance, stabilizing transmission of Gigabit and high-speed digital signals.

High-Tg Material with High Heat Resistance & Anti-Deformation Performance

Capable of enduring multiple lead-free reflow cycles. Minimal warpage occurs during mass SMT assembly; impedance values remain stable against thermal variation for long-term reliable operation.

Outstanding Advantages of Black Solder Mask

Provides light shielding and EMI reduction, improves heat dissipation and visual appearance. It is stain-resistant and wear-resistant, delivering premium aesthetics for high-end products.

ENIG Finish Optimized for Precision BGA Soldering

Flat, oxidation-resistant pads support stable repeated rework soldering. It greatly reduces defects such as BGA cold solder joints and non-wetting, suitable for high-end precision assembly.

Consistent Mass Production via Panelized Design

Multi-unit panels fit automated production lines with small batch-to-batch deviations in impedance, dimension and appearance, ideal for large-scale delivery of medium and big projects.