8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

2-Stage Dual Laser Blind Via Architecture

Progressive interconnection between outer and intermediate layers greatly increases routing density. It supports large high-pin-count BGA ICs, reduces overall PCB dimensions and facilitates equipment miniaturization.

Combination of Dual Resin Plugging & Blind and Buried Vias

Two types of buried vias are filled with resin separately and planarized to eliminate solder entrapment and bubbling during SMT. The design provides moisture and corrosion resistance and improves long-term reliability of multi-layer structures, avoiding flatness defects caused by different buried via configurations.

Customizable Precision Controlled Impedance

Closed-loop full-process control of trace width, copper thickness and dielectric thickness delivers excellent integrity for high-speed differential and single-ended signals, minimizing signal crosstalk and attenuation for high-frequency and high-speed circuits.

ENIG Process for Precision Soldering

Flat BGA pads feature oxidation and tarnish resistance with minimal discoloration after multiple reflow cycles. It offers better stability for ball mounting and fine-pitch IC soldering compared with HASL.

Low Warpage via Stepwise Lamination for 8 Layers

Internal board stress is fully relieved to achieve superior flatness, meeting high-precision assembly requirements of high-speed mounters and ensuring high mass production yield.

High-Recognition Red Solder Mask

It offers stable insulation, oil resistance and scratch resistance, creates distinctive appearance for industrial control products and satisfies assembly aesthetics of end equipment.