12-Layer High-Density Automotive High-Speed PCB

12-Layer Complex Multi-Layer Structure: Large layer count, extremely high routing density, dense pads with large-scale BGA arrays bring high routing difficulty, supporting integration of sophisticated high-speed circuits.

Resin Plugging Process: Eliminates internal voids inside vias, prevents solder balls and provides moisture-proof insulation. It saves routing space and enhances high-density layout capability.

Excellent Rigidity with 2.0mm Board Thickness: Great flatness for large-size panels, suitable for full-area soldering of large BGAs with strong deformation and bending resistance.

ENIG Surface Finish: Uniform plating on pads with outstanding oxidation resistance. Pads remain stable during long-term storage and deliver high assembly yield for precision BGA/QFN mounting.

Optional Custom Controlled Impedance: Accurate impedance matching for single-ended / differential signals ensures high-speed signal integrity and reduces signal crosstalk and loss.

Black Solder Mask presents premium appearance, features light shielding and anti-interference performance, ideal for precision signal circuits.

Stringent multi-layer lamination process with high registration tolerance control. The board withstands thermal shock, temperature and humidity variation for reliable long-term operation.

Custom structures are available including process edges, positioning slots and irregular routing contours, compatible with automated SMT production lines.