4-Layer HDI PCB with Backdrilling & Resin Plugged Via

Custom 4-Layer HDI Precision PCB with Backdrilling & Resin Plugged Vias, ENIG Surface Finish, for Implantable Medical Wireless Charging

Material: FR-4
Layers: 4-Layer
Thickness: 1.6mm
Min. Aperture: 0.15mm
Min. Line Width: 0.23mm
Min. Line Dia.: 0.07mm
Line Width/Spacing: 10/3mil
Surface Finish: ENIG
Features: Backdrilling for High Multi-Layer PCB
Application: Implantable Medical Devices

Product Detail

HDI High-Density Routing

Ultra-fine traces (minimum trace width 0.23 mm / microvia diameter 0.07 mm). Supports routing for miniaturized fine-pitch BGAs to achieve higher integration.

Core Advantages of Backdrilling

Removes excess copper stubs of through vias, suppresses high-frequency signal reflection, reduces signal loss and improves high-frequency signal integrity.

Benefits of Resin Plugging

Vias are fully filled and sealed for moisture and corrosion resistance. It eliminates solder and moisture entrapment, greatly improving BGA soldering yield and meeting high-reliability requirements for medical applications.

ENIG Surface Finish

Uniform plating delivers excellent anti-oxidation and anti-corrosion performance. The board allows multiple rework cycles with stable electrical conductivity.

Standard 1.6mm Board Thickness

Moderate structural rigidity, good compatibility for assembly and strong resistance to bending deformation.

High-Reliability FR-4 Substrate

Withstands high temperatures during lead-free reflow soldering and resists delamination & cracking under thermal cycling. Complies with strict reliability requirements of ISO 13485 medical standard.