0.6mm High‑Density Thin‑Core PCB with Thick Gold Plating

Dual Gold Plating Process Combination
The entire board is coated with thin gold as base layer to protect all traces against oxidation. Selective electroplating of 4 μm thick gold is applied on critical contact pads. The extra‑thick gold layer delivers superior wear resistance, plug‑pull durability and friction tolerance, maintaining stable contact resistance without tarnishing over long‑term operation.

0.6 mm Ultra‑Thin 2‑Layer Structure
Lightweight and flexible for easy assembly inside compact housings. The material features balanced toughness to prevent edge chipping and cracking during depaneling, maximizing space utilization for micro‑sized products.

Distinct Advantages of 4 μm Thick Gold
Compared with standard immersion gold and thin electroplated gold, it provides excellent anti‑sulfidation and corrosion resistance, and withstands hundreds of thousands of contact presses. Greatly improved reliability for frequent make‑and‑break conductive applications.

Panelized Design with Micro‑Routing Depaneling
Optimized for fully‑automated high‑speed SMT assembly for high‑efficiency mass production. It achieves smooth edges with low mechanical stress and minimizes warpage for thin boards.

Optimized Cost Structure
Thick gold is only deposited on contact areas while thin gold is used for remaining regions, balancing wear‑resistance reliability and cost‑effectiveness for volume production.

Moisture & Corrosion Resistance
Full‑board gold plating protects pads and traces from moisture ingress. Suitable for long‑term storage and operation of wearable and portable digital devices.