High-speed, high-precision drilling equipment supporting small hole sizes and multilayer precision processing, ensuring stable hole positioning and reliable subsequent plating.

Digital direct imaging exposure enhances fine line and solder mask registration accuracy, meeting high-density PCB mass production requirements.

Precise temperature, pressure, and interlayer alignment control, suitable for lamination of multilayer, heavy copper, and complex stackup boards.

High-resolution inkjet equipment ensures clear, durable silkscreen markings for improved product identification, traceability, and appearance consistency.

Flexible and efficient open/short detection and electrical verification, providing reliable shipping assurance for prototypes and small-batch orders.