6-Layer Shengyi PCB for Server Storage

Original Shengyi S1000-H Laminate
Excellent thermal stability and low moisture absorption. Resists deformation and delamination during mass reflow soldering. It is a standard material for storage industry with consistent quality. Original material certification is available upon request.

Cost-Optimized Dual Surface Finish
Thick OSP applied on large-area traces for low cost and sufficient oxidation resistance for standard soldering. Selective ENIG on critical BGA pads delivers anti-tarnish and anti-sulfidation performance, ensuring higher reliability after multiple rework cycles.

Beveled Edge Process for Gold Fingers
Chamfered front ends enable smooth insertion and extraction without scratching gold surfaces. Features abrasion and scratch resistance with stable contact resistance under repeated plugging, ideal for memory sockets with frequent mating cycles.

6-Layer Multi-Layer Shielding Structure
Complete power and ground plane design provides outstanding EMI suppression. Ensures good signal integrity for high-speed DDR signals, reduces crosstalk and signal attenuation to meet high-frequency timing requirements.

Panelized Design for Mass Production
Suitable for high-speed volume SMT assembly. Low stress during depaneling minimizes edge chipping and warpage, improving mass production yield.

Advantages of Thick OSP Coating
Thicker organic film offers better resistance to acid, alkali and prolonged storage. Less prone to oxidation and discoloration during long-term warehousing, stabilizing assembly yield.