22‑Layer 2‑Stage HDI PCB with Laser Drilling
Layers：22-Layer Line Width/Spacing：0.076mm Material：FR-4 Surface Finish: Thickness：2.8mm Application：AI High‑Speed Server
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HDI BlindPCB Boards
Juehui over 10 years of high-layer precision PCB technology, focusing on HDI Blind PCB R&D and manufacturing. High wiring density, strong signal integrity and low-loss characteristics, meeting mass production and prototyping needs for complex systems including medical devices, industrial control boards, automotive electronics and communication terminals.
0.4mm Thin‑Profile PCB with Laser Buried & Blind Vias
Layers：4-Layer Line Width/Spacing：0.105mm Material：FR-4 Surface Finish: Thickness：0.4mm Application：Fingerprint & Facial Recognition
High-Tg High-Speed HDI Blind & Buried Via Impedance Controlled PCB
Layers：8-Layer Line Width/Spacing：0.075mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：High-Speed Communication
Smart Wearable HDI RF Rigid-Flex PCB
Layers：4-Layer Line Width/Spacing：0.1mm Material：PP+PI Surface Finish: ENIG Thickness：0.15mm Application：Smart Wearables
6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes
Layers：6-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control
8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias
Layers：8-Layer Line Width/Spacing：0.12mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Premium Intelligent Control
6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias
Layers：6-Layer Line Width/Spacing：0.095mm Material：FR-4 Surface Finish: ENIG Thickness：2.4mm Application：Industrial Robot
6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling
Layers：6-Layer Line Width/Spacing：0.095mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Ethernet
10-Layer 1-Stage HDI High-Speed PCB
Layers：10-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Servo Drive
6-Layer 1-Stage HDI PCB with Mechanical Drilling
Layers：6-Layer Line Width/Spacing：0.203mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Energy Storage System
4-Layer HDI PCB with Backdrilling & Resin Plugged Via
Layers：4-Layer Line Width/Spacing：0.23mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Implantable Medical Devices
HDI High-Density Interconnect PCB with Resin Plugged Vias
Layers：4-Layer Line Width/Spacing：0.2mm Material：FR-4 Surface Finish: HASL Thickness：1.6mm Application：Industrial Multi-IO Control Board
6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance
Layers：6-Layer Line Width/Spacing：0.13mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Industrial AI Vision
8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB
Layers：8-Layer Line Width/Spacing：0.145mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Smart Card Reading Access Control
6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB
Layers：6-Layer Line Width/Spacing：0.01mm Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.0mm Application：Portable Medical Devices
6-Layer Mechanical Blind HDI PCB Rapid Prototyping
Layers：6-Layer Line Width/Spacing：0.18mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Power Mainboard
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