12-Layer Industrial Control High-Speed Communication PCB

Custom Manufacture of 12-Layer Controlled Impedance PCB, High-Layer PCB with Resin Plugging & ENIG, Mainboard for Industrial Control & Communication

Material: FR-4
Layers: 12-Layer
Thickness: 2.0mm
Min. Aperture: 0.2mm
Min. Line Width: 0.11mm
Min. Line Dia.: 0.08mm
Line Width/Spacing: 4/3mil
Surface Finish:
Features: High-Layer PCB, Resin Plugging, Controlled Impedance
Application: Industrial Control & Communication

Product Detail

12-Layer High-Layer Structure: High routing density supports complex high-speed signal wiring with superior integration capability.

Precise Impedance Control: Custom single-ended / differential impedance matches high-speed and high-frequency signal transmission for excellent signal integrity.

Resin Plugging Process: Fully planarized via filling prevents short circuits, moisture ingress and solder balls to enhance reliability, enabling ultra-fine routing.

ENIG (Electroless Nickel Immersion Gold) Surface Finish: Flat solder pads with great oxidation resistance, suitable for precision BGA mounting and delivering reliable soldering performance.

2.0mm Board Thickness with High Rigidity: Excellent bending resistance and flatness, compatible with densely packed BGA packages featuring numerous BGA pads on board.

High Tg Substrate with High Temperature Resistance: Tolerates lead-free reflow soldering and fits mass SMT assembly production.

Panelized Production: Depaneling via mouse bites / V-Cut, compatible with automated SMT assembly lines.

UL94 V0 flame retardant, RoHS compliant, ensuring stable long-term operation.