Panelized Rigid-Flex PCB

Precision Circuit Boards for Medical Testing Equipment, Panelized Rigid-Flex PCB, High Bending Resistant Integrated Circuit Board with FPC Flexible Strips, Prototyping & Mass Production Available

Material: PP+PI
Layers: 8-Layer
Thickness: 0.12mm
Min. Aperture: 0.15mm
Min. Line Width: 0.08mm
Min. Line Dia.: 0.07mm
Line Width/Spacing: 3/3mil
Surface Finish: ENIG
Features: Prepreg (PP) + High Tg
Application: Patient Monitor

Product Detail

Panelized Array Design

8-up panel production improves SMT mounting efficiency and reduces unit cost. Panels can be depaneled into individual units before delivery.

Integrated Rigid-Flex Construction

Rigid sections carry surface-mount components, while flexible strips enable three-dimensional bent interconnection. Connectors are eliminated, reducing overall device size by over 60%.

Ultra-High Bending Endurance

The flexible strips withstand ≥100,000 dynamic bending cycles without open circuits, with minimum bending radius ≥1.5 times flexible strip thickness. Excellent anti-fatigue and vibration resistance.

High-Density Routing

Supports blind/buried vias and laser microvias to accommodate high-density multi-chip layouts, delivering stable, low-loss signal transmission.

Monolithic Lamination Without Delamination

Molecular bonding at rigid-flex transition zones prevents blistering and delamination under thermal cycling. Reliability greatly surpasses separate rigid board + FPC assembly solutions.