High-Temperature Resistant PI ENIG Rigid-Flex PCB

Long Strip Multi-Unit Array Panelized Design

Multiple independent units integrated on a single panel, compatible with fully automatic SMT production lines for mass processing. It delivers high depaneling efficiency, lower production cost and superior batch consistency.

High-Temperature Resistant PI Flexible Structure

The flexible section features outstanding thermal resistance, suitable for long-term heat-generating environments of batteries and power supplies. It can withstand tens of thousands of repeated bends without fracture, supporting bent routing in confined spaces.

Integrated Rigid-Flex Design Simplifies Device Structure

Rigid sections are used for component mounting, while flexible sections enable spatially bent routing. External FPC connectors are eliminated to reduce overall dimensions and cut assembly procedures.

Higher Reliability of ENIG Pads

Solder pads resist oxidation and sulfidation and support multiple rework soldering cycles. Cold solder joints are less likely to occur under prolonged humid conditions, ensuring stable contact for multi-channel signal acquisition.

Mature Rigid-Flex Transition Technology

Specialized PP bonding layer relieves bending stress. The transition zone resists delamination and cracking, ideal for long-strip applications requiring continuous long-distance bending.

Thermal & Weather Resistance for Harsh Industrial Conditions

Combination of high-Tg rigid substrate and high-temperature resistant PI meets the requirements of long-term operation under high temperature, enclosed and humid environments inside battery packs.