2OZ Heavy Copper PCB with Full‑Board Electroplated Gold

2OZ Heavy Copper Design
Offers high current‑carrying capacity and low voltage drop. Suitable for high‑current audio loops and power traces, delivering better heat dissipation than standard 1OZ copper material.

Full‑Board Electroplated Gold 3μ"
Full‑area gold plating provides excellent oxidation and corrosion resistance with superior solder wettability. Gold layer hardly peels off during multiple reworks, well‑suited for precision SMT mounting of MEMS microphones.

Simplified 2‑Layer Stack‑up
Cost‑effective with streamlined routing and low signal interference, ideal for weak audio‑signal transmission.

0.8mm Thin‑Board Thickness
Light‑weight board fits compact assembly inside microphone cavities. High forming accuracy for round and special‑shaped profiles.

Black Solder Mask Surface
Premium appearance with light‑shielding and anti‑interference performance, meeting aesthetic requirements for high‑end audio products.

Tab‑Routed Panel Process
Optimized for high‑volume SMT assembly. Easy depaneling improves overall processing efficiency.

Reliable Insulation Performance
Resists moisture and temperature variation. Ensures stable pickup‑signal transmission and reduces noise interference.