Smart Wearable HDI RF Rigid-Flex PCB

Differentiated Ultra-Thin Mixed Thickness Zoned Structure
The 0.15mm ultra-thin flexible section enables high-frequency repeated bending with small bending radius, suitable for compact folding or rotating space. The 0.6mm ultra-thin rigid board greatly reduces overall product thickness with prominent advantages in lightweight design.

Matrix Panelized Design for Cost-Effective Mass Production
Multiple independent units integrated on one panel, compatible with automated SMT production lines. It delivers good batch consistency and high depaneling efficiency, effectively lowering unit cost for large-scale production.

ENIG Process Ensures High Soldering Reliability
Dense pads resist oxidation and sulfidation, maintaining stable performance even after multiple rework soldering. It avoids cold solder joints and poor contact under humid wearable operating environments.

Fatigue Resistance Optimized Design at Rigid-Flex Transition
Specialized PP bonding layer distributes bending stress. After long-term repeated folding, the transition area between rigid and flexible sections is less prone to circuit breakage and delamination for extended service life.

Slim & Compact for Portable Products
Ultra-thin overall thickness meets the extreme space layout requirements of smart wearables and miniature electronic devices. Simplified mechanical assembly eliminates the need for external FPC connectors.

Weather Resistance for Complex Wearable Working Conditions
Combination of high-Tg rigid substrate and heat-resistant PI material features excellent resistance to temperature variation, sweat and humidity. The circuit board operates stably long-term under temperature fluctuation and moist environments for wearable devices.