0.2mm Ultra‑Thin PCB with Resin Plugged Vias

Ultra‑Thin 0.2mm Thin‑Core PCB Fabrication, Micro‑Via Resin Plugging Process, Immersion Gold Special‑Shaped Cut‑out Precision 2‑Layer Circuit Board

Material: FR-4
Layers: 2-Layer
Thickness: 0.2mm
Min. Aperture: 0.2mm
Min. Line Width: 0.1mm
Min. Line Dia.: 0.07mm
Line Width/Spacing: 4/3mil
Surface Finish: ENIG
Features: Ultra‑Thin Rigid PCB Featuring Resin Plugging
Application: Bluetooth Earbuds

Product Detail

0.2 mm Ultra‑Slim Profile
The extreme thin‑thickness delivers outstanding space utilization. It fits compact cavity assembly for earbuds and micro‑components, enabling lightweight and compact mechanical design.

Resin‑Plugged Vias Process
Micro‑vias are filled and planarized, preventing solder penetration and short‑circuiting for BGA and dense vias. It improves assembly yield for microchips and reduces required routing area.

Immersion Gold Surface Finish
Smooth oxidation‑resistant solder pads offer excellent solder wettability. Tiny pads achieve reliable soldering with minimal gold loss upon multiple reworks, ideal for precision micro‑component mounting.

High‑Toughness Ultra‑Thin Base Material
Features moderate flexibility to resist delamination and cracking under minor deformation, suitable for curved and special‑shaped assembly structures.

Custom Cut‑out & Special Profile
Supports circular cutouts and complex inner‑outer contour routing to realize mechanical keep‑out design requirements.

Tab‑Routed Panel Design
Optimized for fully‑automated SMT high‑volume assembly. Easy depaneling boosts mass‑production efficiency.

Stable Insulation for Ultra‑Thin Core
Consistent interlayer insulation under temperature fluctuation and humid conditions, ensuring interference‑free transmission of weak sensing signals.