6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

1-Stage HDI High-Density Routing

Adopting laser blind via design to reduce routing space around BGAs. It enables wiring for fine-pitch ICs, delivering smaller board dimension and higher integration level.

Precise Controlled Impedance

Accurate matching of interlayer dielectrics ensures signal integrity for high-speed differential and RF signals, minimizing signal reflection and attenuation.

Resin Plugging Process

Through holes are fully filled and planarized with resin. It prevents flux entrapment and moisture ingress, greatly improving BGA soldering yield with enhanced resistance to humidity, heat and vibration.

ENIG Surface Finish

Uniform plating offers excellent anti-oxidation and anti-corrosion performance. Suitable for repeated rework soldering and precision BGA assembly with stable electrical contact conductivity.

Fixed 2.0mm Board Thickness

Superior structural strength, compatible with mechanical fastening and thermal layout of complete equipment, and resistant to bending deformation.

High Tg Temperature-Resistant Substrate

Supports lead-free high-temperature reflow soldering. The laminate resists delamination and cracking during thermal cycling for reliable long-term operation.

High Wiring Density

Satisfies high-density pin routing requirements of high-end video main controller ICs such as Ingenic. Supports transmission of high-speed USB, serial port and high-speed image signals.