8-Layer PCB with Half Holes on Four Sides

8-Layer High Multi-Layer Structure

Independent power and ground layers provide isolation to resist EMI and ensure excellent high-speed signal integrity, suitable for routing of large BGA multi-core processors.

Resin Plugging Process

Vias under BGAs are fully filled and planarized to prevent solder sinking and cold joints. It saves routing space and improves assembly yield for high-density layout.

Four-Sided Castellated Hole Design

Exposed gold-plated castellated holes along board edges enable reliable plug-in connection and easy module assembly. They can replace gold finger connectors to save structural space.

ENIG Surface Finish

Flat solder pads with good oxidation resistance. No gold peeling during repeated rework soldering, ideal for precision BGA and QFP component mounting.

Standard 1.2mm Board Thickness

Moderate rigidity with good deformation resistance, offering high versatility for end-product assembly.

4-Up Tab-Routed Panel for Mass Production

Compatible with fully automatic high-volume SMT assembly. Easy depaneling helps reduce production costs.

Customizable Controlled Impedance

Meets transmission requirements for differential signals such as DDR, high-speed USB and Ethernet interfaces.