High Frequency RF Signal Copper Substrate PCB

Full Copper on Backside for Superior Shielding & Heat Dissipation
Large continuous ground copper foil effectively isolates external electromagnetic interference and reduces RF radiation leakage. Meanwhile, it rapidly dissipates heat from chips and restrains impedance drift caused by temperature rise.

Precisely Controllable RF Impedance with Stable High-Frequency Performance
Dual control via dielectric material selection and trace width/spacing manufacturing. Tight impedance tolerance for single-ended and differential traces ensures low high-frequency signal loss and excellent phase consistency, suitable for precision RF testing applications.

0.8mm Slim Structure Compatible with Cavity Assembly
Moderate thickness provides sufficient rigidity. It can be compactly installed inside TEM test cavities for convenient mechanical assembly without occupying excessive internal space.

ENIG Surface Finish Ensures Reliability of RF Contacts
Pads resist oxidation and sulfidation. Contact resistance remains stable under repeated plugging and humid-heat environments, preventing RF signal fluctuation.

Low-Loss Laminate for High-Frequency Operation
Specialized low Dk/Df resin system reduces high-frequency insertion loss and crosstalk, meeting high-precision specifications of test & measurement instruments.

Optimized Ground Integrity Improves RF Performance
Continuous full ground copper creates short and complete return paths, mitigating resonance and spurious interference to enhance overall RF stability.