COB Aluminum Substrate for Smart Home Lighting Board

Aluminum Substrate with Excellent Heat Dissipation
Aluminum base material features much higher thermal conductivity than FR4 fiberglass boards. It rapidly dissipates heat generated by LEDs to reduce light attenuation and extend LED lifespan, ideal for densely arranged high-power LEDs.

High-Reflective White Solder Mask for Improved Luminous Efficiency
White solder mask delivers high reflectivity and minimizes light absorption loss to boost overall lamp brightness. It offers UV resistance and anti-yellowing performance, resisting discoloration after long-time illumination.

Stable Soldering with HASL Surface Finish
HASL pads feature good flatness and uniform tin coverage for high SMT assembly yield. The surface is anti-oxidation and moisture-proof, avoiding poor solder joints caused by oxidation during storage and long-term operation.

Moderate 1.0mm Thickness
Sufficient rigidity prevents bending and deformation while facilitating lamp structural assembly, balancing mechanical strength and lightweight requirements.

Dual-Circular Panelized Design for Mass Production
Two circular units on one panel, compatible with automated SMT and depaneling. It lowers mass production cost and ensures consistent dimensions.

Safe & Reliable Dielectric Layer
High withstand-voltage insulating dielectric prevents electric leakage and short circuits, complying with safety standards for lighting products. No delamination or blistering under thermal cycling.