Rigid-Flex PCB for Medical Ultrasound Probes

Ultra-Thin Differentiated Thickness Structure

The 0.15 mm flexible section enables high-frequency bending with a small radius. The 0.4 mm ultra-thin rigid section greatly reduces overall product thickness, suitable for extremely compact assembly spaces such as ultrasound probes and portable instruments.

Outstanding Advantages of Matrix Panelized Mass Production

Multiple units are integrated on a single panel, compatible with automated SMT production lines. It delivers high consistency in mass manufacturing and high depaneling efficiency, effectively cutting large-scale production costs.

Thick ENIG Ensures Long-Term Soldering Reliability

The thick gold layer offers strong resistance to oxidation and sulfidation, maintaining excellent solderability even after multiple rework cycles. It ensures stable contact resistance under long-term humid operating conditions of medical equipment.

Anti-Slip Grid Solder Mask Design

Grid-textured solder mask on rigid boards improves anti-slip performance during component mounting and enhances heat dissipation, preventing component shifting in automated assembly.

Fatigue Resistance Optimization at Rigid-Flex Junction

Specialized PP bonding layers distribute bending stress. Under frequent swinging and bending of probes, the rigid-flex transition zone resists circuit breakage and delamination for extended service life.

Lightweight & Weather-Resistant, Compliant with Medical Standards

Halogen-free eco-friendly materials withstand temperature and humidity fluctuations in medical disinfection environments and meet access specifications for medical electronics.