HDI High-Density Interconnect PCB with Resin Plugged Vias

4-Layer HDI Blind Via Structure

Blind vias shorten signal paths and significantly increase routing density. Ideal for layout of dense-pin QFN/QFP ICs, reducing overall PCB size and suppressing EMI interference.

Resin Plugging Process

Vias are fully filled and planarized to ensure flat BGA pads without depressions. It prevents solder balls, cold joints and short circuits during soldering, greatly improving mass SMT assembly yield.

Leaded HASL Surface Finish

Uniform tin coating delivers excellent solder wetting, compatible with both through-hole and surface-mount components. Resistant to repeated rework soldering with outstanding cost performance, suitable for mass production.

Standard 1.6mm Board Thickness

Moderate mechanical rigidity and good resistance to warpage. Highly versatile for cabinet assembly with balanced thermal and structural adaptability.

V-CUT 3-Up Panel Design

Suitable for fully automatic inline SMT production. Convenient depaneling effectively reduces manufacturing costs in mass production.

Layered Power & Ground Shielding Design

Separation of strong and weak electric circuits avoids crosstalk among multi-channel acquisition signals and maintains stable sampling accuracy.

HDI Fine-Line Capability

Supports fine traces and micro-vias to meet high-density routing requirements.