6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

3.0mm 6-Layer Thick Board Structure: High structural rigidity, vibration resistance and low deformation risk. Multi-layer power and ground shielding layers deliver strong EMI immunity and prevent crosstalk between multi-channel signals.

Custom Special Substrates: Materials can be selected on demand for special properties including high temperature resistance, low water absorption, high frequency low loss, high voltage insulation and more, suitable for harsh operating environments where standard FR-4 cannot meet requirements.

Precision Countersunk Hole Technology: The board surface remains flat without protrusions after screw fastening, enabling compact assembly of finished equipment. Countersink angle and depth are precisely controlled within tolerances to ensure uniform fastening stress and reduce board cracking risk.

ENIG Surface Finish: Pads feature excellent oxidation and corrosion resistance, ensuring reliable soldering for precision QFN chips. The finish resists gold peeling during repeated rework soldering and offers superior long-term stability compared with HASL.

Stepwise Lamination Process: Effectively relieves internal stress of thick boards, solving common defects such as warpage, delamination and blistering. It maintains stable dimensions under temperature variation.

Long & Irregular Panelization Design: Compatible with automatic high-volume SMT assembly and easy depaneling, helping control mass production costs.

Optional Custom Controlled Impedance: Guarantees consistent transmission of high-speed differential and RF signals, ideal for precision high-speed circuit designs.