Product Display

6 Layer 1-Order HDI Precision Buried Blind Via PCB

Layers：6-Layer Line Width/Spacing：0.075mm Material：FR-4 Surface Finish: ENIG Thickness：0.8mm Application：Communication

High Precision HDI Board, 6-Layer 1-Order Buried & Blind Via PCB

Layers：6-Layer Line Width/Spacing：0.075mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Micro Display

14-layer multilayer PCB

Layers：14-Layer Line Width/Spacing：0.2mm Material：FR-4 Surface Finish: ENIG Thickness：2.5mm Application：High-end Power Supplies

22‑Layer 2‑Stage HDI PCB with Laser Drilling

Layers：22-Layer Line Width/Spacing：0.076mm Material：FR-4 Surface Finish: Thickness：2.8mm Application：AI High‑Speed Server

6-layer 1-stage Precision Buried & Blind Via PCB

Layers：6层 Line Width/Spacing：0.075mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Communication Field

10‑Layer Halogen‑Free High‑Speed Communication PCB

Layers：10-Layer Line Width/Spacing：0.1mm Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.6mm Application：Automotive

Panasonic MEGTRON6 (M6) Hybrid Laminated High-Speed PCB

Layers：6-Layer Line Width/Spacing：0.1mm Material：Panasonic M6 Surface Finish: ENIG Thickness：2.4mm Application：Communication

6-layer Automotive PCB

Layers：6-Layer Line Width/Spacing：0.1mm Material：High Tg FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Automotive

6-Layer Pure Rogers 4350B High Frequency PCB

Layers：6-Layer Line Width/Spacing：0.1mm Material：4350B Surface Finish: ENIG Thickness：1.6mm Application：Industrial RF Circuit Board

6-Layer Rogers RO4350B Hybrid PCB

Layers：6-Layer Line Width/Spacing：0.2mm Material：Rogers4350B Surface Finish: ENIG Thickness：1.2mm Application：High Frequency RF Circuit Board

6-Layer Medical Grade PCB for EU & US Medical Devices

Layers：6-Layer Line Width/Spacing：0.1mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Medical Robot

10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance

Layers：10-Layer Line Width/Spacing：0.07mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Aviation Navigation

Rigid-Flex PCB (4 Rigid Layers + 2 Flexible Layers)

Layers：4-Layer Line Width/Spacing：0.15mm Material：FR4+PP+PI Surface Finish: ENIG Thickness：1.6mm Application：AI Control System Integration

8‑Layer High‑Speed Signal Main Controller PCB

Layers： Line Width/Spacing：0.09mm Material：FR-4 Surface Finish: HASL‑Lead‑Free Thickness：1.6mm Application：Network Communication

12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication

Layers：12-Layer Line Width/Spacing：0.067mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：High‑Speed Communication

12-Layer High-End Medical Main Control PCB

Layers：12-Layer Line Width/Spacing：0.11mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：High-Frequency Data PCB

Panelized Rigid-Flex PCB

Layers：10-Layer Line Width/Spacing：0.08mm Material：PP+PI Surface Finish: ENIG Thickness：0.12mm Application：Patient Monitor

Export Rigid-Flex PCB for National Defense Communication Equipment

Layers：8-Layer Line Width/Spacing：0.1mm Material：PP+PI Surface Finish: Electroplated Hard Gold Thickness：0.15mm Application：Aerospace & Defense

8-Layer Heavy Copper Substrate with Conductive Copper Paste Plugged Vias

Layers：8-Layer Line Width/Spacing：0.19mm Material：FR-4 Surface Finish: ENIG Thickness：3.2mm Application：BMS Balancing Main Controller

8-Layer 3OZ Heavy Copper PCB

Layers：8-Layer Line Width/Spacing：0.29mm Material：FR-4 Surface Finish: ENIG Thickness：2.6mm Application：Energy Storage Power Supply

6-Layer Shengyi PCB for Server Storage

Layers：6-Layer Line Width/Spacing：0.152mm Material：Shengyi S1000-H Surface Finish: OSP+ENIG Thickness：1.6mm Application：Server & Storage

12-Layer Industrial Control High-Speed Communication PCB

Layers：12-Layer Line Width/Spacing：0.11mm Material：FR-4 Surface Finish: Thickness：2.0mm Application：Industrial Control & Communication

12-Layer High-Density Automotive High-Speed PCB

Layers：12-Layer Line Width/Spacing：0.08mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics

6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes

Layers：6-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control

8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：8-Layer Line Width/Spacing：0.12mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Premium Intelligent Control

6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias

Layers：6-Layer Line Width/Spacing：0.095mm Material：FR-4 Surface Finish: ENIG Thickness：2.4mm Application：Industrial Robot

6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling

Layers：6-Layer Line Width/Spacing：0.095mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Ethernet

10-Layer 1-Stage HDI High-Speed PCB

Layers：10-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Servo Drive

6-Layer 1-Stage HDI PCB with Mechanical Drilling

Layers：6-Layer Line Width/Spacing：0.203mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Energy Storage System

8-Layer PCB with Half Holes on Four Sides

Layers：8-Layer Line Width/Spacing：0.1mm Material：FR-4 Surface Finish: ENIG Thickness：1.2mm Application：Edge Computing

4-Layer HDI PCB with Backdrilling & Resin Plugged Via

Layers：4-Layer Line Width/Spacing：0.23mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Implantable Medical Devices

HDI High-Density Interconnect PCB with Resin Plugged Vias

Layers：4-Layer Line Width/Spacing：0.2mm Material：FR-4 Surface Finish: HASL Thickness：1.6mm Application：Industrial Multi-IO Control Board

6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance

Layers：6-Layer Line Width/Spacing：0.13mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Industrial AI Vision

8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB

Layers：8-Layer Line Width/Spacing：0.145mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Smart Card Reading Access Control

6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB

Layers：6-Layer Line Width/Spacing：0.01mm Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.0mm Application：Portable Medical Devices

6-Layer Mechanical Blind HDI PCB Rapid Prototyping

Layers：6-Layer Line Width/Spacing：0.18mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Power Mainboard

12-Layer Industrial Control PCB Prototype

Layers：12-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: HASL Thickness：3.0mm Application：Multi-channel Solenoid Valve Board

4-Layer FR-4 PCB Custom Fabrication

Layers：4-Layer Line Width/Spacing：0.22mm Material：FR-4 Surface Finish: ENEPIG Thickness：5.0mm Application：Optoelectronics Industry

12-Layer High-Speed PCB for Automotive Applications

Layers：12-Layer Line Width/Spacing：0.08mm Material：TU872 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics

14-Layer High Frequency PCB with Taiyao Material

Layers：14-Layer Line Width/Spacing：0.11mm Material：TU872 Surface Finish: ENIG,2U” Thickness：2.0mm Application：Automotive Electronics