14-layer multilayer PCB

Juehui Weiye Circuit manufactures custom 14-layer rigid multi-layer PCBs. This sample has dimension of 156×119mm, finished thickness of 2.0mm, panelized design with ENIG surface finish. It integrates BGA pads, special cutouts and mixed-size microvias, categorized as high-density high-speed multi-layer PCB.

The 14-layer stack-up provides abundant power layers, ground layers and signal layers, delivering excellent shielding performance and reducing crosstalk. We support impedance control, backdrilling, resin plug vias and via-in-pad for precise BGA component soldering.

Our service covers PCB prototyping, low-volume trial production and mass panel production. One-stop PCBA service including SMT assembly is available. Our factory in Shenzhen provides fast lead time and expedited samples.

Key Specifications

• Product Name: 14-Layer Rigid Multi-layer PCB

• Dimension: 156 × 119mm (Panelized)

• Finished Thickness: 2.0mm

• Layer Count: 14 Layers Rigid PCB

• Base Material: High TG FR-4 (TG170℃); high-speed laminate / high-frequency RF material optional; impedance-controlled PCB available

• Minimum Line Width / Line Spacing: 0.075mm / 0.075mm (precision process)

• Minimum Hole Size: 0.1mm (laser blind via); minimum mechanical hole:0.2mm

• Surface Finish: ENIG (Sample finish); hard gold plating, immersion tin, immersion silver, OSP, HASL, ENEPIG optional

• Special Process: Special cutout, panelization, BGA pads, resin plug vias, backdrilling, impedance control

• Flame Retardant: UL94 V-0, halogen-free option available

• Insulation Material: Epoxy glass prepreg (PP), low CTE formula, anti-delamination & anti-warpage

• Tolerance: Line width, hole location and outline comply with IPC-A-600; special tolerances per customer drawings acceptable

• Certifications: ISO9001, ISO13485, RoHS compliant; UL documents available upon request

Product Advantages

1. 14-layer high-density stack-up for stable high-speed signal

Multi-layer power and ground segmentation with strong shielding effect to reduce signal crosstalk. Differential traces and precise impedance control available to meet high-speed & RF transmission requirements.

2. ENIG finish + BGA design for reliable soldering

ENIG surface treatment features outstanding oxidation resistance. Flat BGA pads support multiple reflow cycles and guarantee high soldering yield for precision BGA components.

3. Special cutout & panelization for automatic assembly

Boards with special hollow cutouts and multi-position mounting holes. Panel delivery directly fits customer SMT automatic production line, improves assembly efficiency and reduces unit loss.

4. High TG material for temperature resistance & low deformation

TG170 high TG laminate with low CTE resin system. Controlled board warpage after multiple lamination and reflow, anti-CAF, suitable for harsh working environment.

5. One-stop supporting service

Customization based on Gerber or samples, PCB prototyping, low & mass volume production. Supporting services: SMT assembly, PCBA manufacturing, conformal coating, laser depaneling.

In-house factory in Shenzhen, expedited samples available. Free pre-project DFM review, impedance calculation and stack-up optimization.

Typical Applications

✅ Communication: 5G communication modules, optical modules, switches, RF baseband motherboards

✅ Medical Electronics: Medical imaging, ultrasound devices, main control boards of portable medical detectors

✅ Computing & Industrial Control: FPGA boards, AI computing boards, machine vision, industrial control motherboards

✅ Automotive Electronics: Automotive domain controller, vehicle camera, ADAS signal acquisition boards

✅ Test & Instrument: High-speed signal collectors, radar modules, precision measuring equipment

Service Process

1. Customer supply: PCB files (Gerber/PADS/Altium), stack-up requirements, impedance specs, material and process specifications

2. Technical Review: Juehui engineers perform DFM check, confirm stack-up, BGA layout, cutout and impedance solution

3. Quotation & Confirmation: Issue formal quotation and confirm lead time

4. Production: Multi-layer lamination, drilling, patterning, solder mask, ENIG plating, routing, AOI, X-ray inspection and electrical test

5. Delivery: Bare panel PCB delivery, or handover for SMT assembly and final PCBA delivery

Notes

14-layer high multi-layer PCB has complex manufacturing process. Stack-up design, material selection, BGA layout and special cutouts will affect cost, yield and board warpage. We recommend communicating your design in advance before order placement. Juehui Weiye provides free DFM review to avoid design risks and optimize mass production cost.