Rigid-Flex PCB (4 Rigid Layers + 2 Flexible Layers)

Juehui Weiye Circuit specializes in custom manufacturing of rigid-flex PCBs. Combining the structural stability of rigid PCBs and the bendable, lightweight advantages of FPC flexible circuits, rigid-flex boards integrate rigid sections and flexible sections in one piece without extra connectors. It reduces assembly components and the risk of poor contact, catering to designs with limited space, dynamic bending requirements and 3D assembly.

We manufacture multi-layer boards and HDI boards with blind & buried vias. Impedance control and RF material selection are available. Services cover PCB prototyping, low-volume trial production and mass production. One-stop PCBA service including SMT assembly is offered. Our factory in Shenzhen supports fast delivery and expedited samples.

Key Specifications

• Product Name: Rigid-Flex PCB

• Layer Count: 2 ~ 26 layers, custom HDI blind & buried via structure available

• Base Materials: FR-4, high-TG material, high-frequency RF laminate, PI flexible substrate; impedance-controlled PCB available

• Minimum Line Width / Line Spacing: 0.075mm / 0.075mm (precision process)

• Minimum Hole Size: 0.1mm (laser via); minimum mechanical hole: 0.2mm

• Bending Area: Flexible PI area, designed for repeated dynamic bending; impedance controllable

• Surface Finishes: ENIG, hard gold plating, immersion tin, immersion silver, OSP, HASL, etc.

• Board Thickness: Rigid area: 0.2~3.2mm; PI flexible area: 0.025~0.1mm

• Tolerance: Line width, hole location and outline comply with IPC-A-600; special tolerances per customer drawings are acceptable

• Certifications: ISO9001, ISO13485 (medical grade), RoHS compliant; UL documents available upon request

Product Advantages

1. Integrated structure for space saving

Monolithic rigid and flexible structure eliminates connectors and cables, greatly reducing overall product size. Ideal for slim and lightweight product design and supports 3D assembly.

2. High reliability & lower failure rate

Fewer soldering joints to avoid loose cables and bad contact. Flexible PI section withstands repeated bending and vibration, suitable for equipment under dynamic and vibrating working conditions.

3. High-precision manufacturing capability

Support HDI blind & buried vias, impedance control, backdrilling and differential traces. High-frequency laminates can be adopted for RF rigid-flex boards to meet high-speed and RF signal transmission requirements.

4. One-stop supporting service

Customization from Gerber or samples. PCB prototyping, low & mass volume production. Supporting services: SMT assembly, PCBA manufacturing, conformal coating, laser depaneling.

5. Flexible delivery

In-house factory in Shenzhen. Expedited samples available. We support pre-project technical evaluation, impedance calculation and stack-up discussion according to your project schedule.

Typical Applications

✅ Medical Devices: Endoscopes, portable analyzers, wearable medical monitoring equipment

✅ Consumer Electronics: Smart watches, TWS earbuds, VR/AR modules, circuit for foldable products

✅ Communication & RF: Compact RF modules, GNSS positioning modules, portable communication terminals

✅ Industrial Control: Industrial inspection probes, motion sensors, portable industrial data acquisition equipment

✅ Automotive Electronics: Automotive sensors, vehicle camera modules, in-vehicle control subassemblies

Service Process

1. Customer supply: PCB files (Gerber/PADS/Altium), stack-up requirements, impedance specs, material and process specifications

2. Technical Review: Juehui engineers perform DFM (Design for Manufacturability) check, confirm stack-up, bending zones and impedance solution

3. Quotation & Confirmation: Issue formal quotation and confirm lead time

4. Production: Rigid-flex PCB fabrication, AOI inspection, impedance test and bending reliability sampling test

5. Delivery: Bare PCB delivery, or handover for SMT assembly and final PCBA delivery

Notes

Rigid-flex PCB has higher process complexity than standard PCB. Flexible zone layout, bending radius and stack-up design directly affect cost and yield. We recommend discussing your structure solution in advance before order placement. Free DFM review is provided to avoid design risks and reduce mass production cost.