22‑Layer 2‑Stage HDI PCB with Laser Drilling
Layers：22-Layer Line Width/Spacing：0.076mm Material：FR-4 Surface Finish: Thickness：2.8mm Application：AI High‑Speed Server
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High MultilayerPCB Boards
Juehui over 10 years of high-layer precision PCB technology, focusing on High Multilayer PCB R&D and manufacturing. High wiring density, strong signal integrity and low-loss characteristics, meeting mass production and prototyping needs for complex systems including medical devices, industrial control boards, automotive electronics and communication terminals.
10‑Layer Military‑Grade Precision Circuit Board, Immersion Gold, Controlled Impedance
Layers：10-Layer Line Width/Spacing：0.07mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Aviation Navigation
8‑Layer High‑Speed Signal Main Controller PCB
Layers： Line Width/Spacing：0.09mm Material：FR-4 Surface Finish: HASL‑Lead‑Free Thickness：1.6mm Application：Network Communication
10‑Layer Halogen‑Free High‑Speed Communication PCB
Layers：10-Layer Line Width/Spacing：0.1mm Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.6mm Application：Automotive
12‑Layer High‑Speed PCB with Back‑Drilling for Wireless Communication
Layers：12-Layer Line Width/Spacing：0.067mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：High‑Speed Communication
12-Layer High-End Medical Main Control PCB
Layers：12-Layer Line Width/Spacing：0.11mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：High-Frequency Data PCB
8-Layer Heavy Copper Substrate with Conductive Copper Paste Plugged Vias
Layers：8-Layer Line Width/Spacing：0.19mm Material：FR-4 Surface Finish: ENIG Thickness：3.2mm Application：BMS Balancing Main Controller
8-Layer 3OZ Heavy Copper PCB
Layers：8-Layer Line Width/Spacing：0.29mm Material：FR-4 Surface Finish: ENIG Thickness：2.6mm Application：Energy Storage Power Supply
6-Layer Shengyi PCB for Server Storage
Layers：6-Layer Line Width/Spacing：0.152mm Material：Shengyi S1000-H Surface Finish: OSP+ENIG Thickness：1.6mm Application：Server & Storage
12-Layer Industrial Control High-Speed Communication PCB
Layers：12-Layer Line Width/Spacing：0.11mm Material：FR-4 Surface Finish: Thickness：2.0mm Application：Industrial Control & Communication
12-Layer High-Density Automotive High-Speed PCB
Layers：12-Layer Line Width/Spacing：0.08mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics
6-Layer 2-Stage HDI PCB with ENIG & Countersunk Holes
Layers：6-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: ENIG Thickness：3.0mm Application：High-End Industrial Measurement & Control
8-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias
Layers：8-Layer Line Width/Spacing：0.12mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Premium Intelligent Control
6-Layer 2-Stage HDI PCB with Laser Drilling, Blind and Buried Vias
Layers：6-Layer Line Width/Spacing：0.095mm Material：FR-4 Surface Finish: ENIG Thickness：2.4mm Application：Industrial Robot
6-Layer 1-Stage HDI Controlled Impedance PCB with Laser Drilling
Layers：6-Layer Line Width/Spacing：0.095mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Ethernet
10-Layer 1-Stage HDI High-Speed PCB
Layers：10-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Industrial Servo Drive
6-Layer 1-Stage HDI PCB with Mechanical Drilling
Layers：6-Layer Line Width/Spacing：0.203mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Energy Storage System
8-Layer PCB with Half Holes on Four Sides
Layers：8-Layer Line Width/Spacing：0.1mm Material：FR-4 Surface Finish: ENIG Thickness：1.2mm Application：Edge Computing
4-Layer HDI PCB with Backdrilling & Resin Plugged Via
Layers：4-Layer Line Width/Spacing：0.23mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Implantable Medical Devices
HDI High-Density Interconnect PCB with Resin Plugged Vias
Layers：4-Layer Line Width/Spacing：0.2mm Material：FR-4 Surface Finish: HASL Thickness：1.6mm Application：Industrial Multi-IO Control Board
6-Layer 1-Stage HDI PCB with Resin Plugged Vias & Controlled Impedance
Layers：6-Layer Line Width/Spacing：0.13mm Material：FR-4 Surface Finish: ENIG Thickness：2.0mm Application：Industrial AI Vision
8-Layer 3-Stage Laser Drilled HDI Controlled Impedance PCB
Layers：8-Layer Line Width/Spacing：0.145mm Material：FR-4 Surface Finish: ENIG Thickness：1.0mm Application：Smart Card Reading Access Control
6-Layer 2-Stage High-Speed HDI Blind & Buried Via PCB
Layers：6-Layer Line Width/Spacing：0.01mm Material：FR-4 Surface Finish: ENIG 2U" Thickness：1.0mm Application：Portable Medical Devices
6-Layer Mechanical Blind HDI PCB Rapid Prototyping
Layers：6-Layer Line Width/Spacing：0.18mm Material：FR-4 Surface Finish: ENIG Thickness：1.6mm Application：Power Mainboard
12-Layer Industrial Control PCB Prototype
Layers：12-Layer Line Width/Spacing：0.15mm Material：FR-4 Surface Finish: HASL Thickness：3.0mm Application：Multi-channel Solenoid Valve Board
4-Layer FR-4 PCB Custom Fabrication
Layers：4-Layer Line Width/Spacing：0.22mm Material：FR-4 Surface Finish: ENEPIG Thickness：5.0mm Application：Optoelectronics Industry
12-Layer High-Speed PCB for Automotive Applications
Layers：12-Layer Line Width/Spacing：0.08mm Material：TU872 Surface Finish: ENIG Thickness：2.0mm Application：Automotive Electronics
14-Layer High Frequency PCB with Taiyao Material
Layers：14-Layer Line Width/Spacing：0.11mm Material：TU872 Surface Finish: ENIG,2U” Thickness：2.0mm Application：Automotive Electronics
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