Rogers 4350B Mixed Lamination Industrial RF PCB

High-Frequency RF PCB, 4-Layer RO4350B Mixed Lamination Circuit Board, Industrial Wireless Communication PCB, Immersion Gold PCB Customization

Material: Rogers4350B
Layers: 4-Layer
Thickness: 0.8mm
Min. Aperture: 0.2mm
Min. Line Width: 0.15mm
Min. Line Dia.: 0.15mm
Line Width/Spacing: 6/6mil
Surface Finish: ENIG
Features: Rogers 4350B Mixed Lamination
Application: Industrial Wireless Comm Equipment

Product Detail

4-Layer Rogers 4350B Hybrid Lamination PCB for Industrial RF

Product Overview

This is a 4-layer hybrid PCB with Rogers RO4350B, finished thickness 0.8mm. It adopts hybrid structure: Rogers RO4350B high-frequency material on outer layers and FR-4 on inner layers, balancing excellent RF electrical performance and cost efficiency. Surface finish is ENIG (Electroless Nickel Immersion Gold). Minimum hole size 0.2mm, minimum line width/space 6mil/6mil. Designed for industrial RF & wireless communication applications.

Rogers RO4350B is ceramic-filled hydrocarbon high-frequency laminate with low dielectric loss. It delivers low signal attenuation and stable impedance at 2.4GHz & 5.8GHz. The hybrid stack-up maintains good RF performance while cutting material cost, which becomes the popular solution for industrial RF modules.

Key Specifications

- Layers: 4 Layers

- Material: Rogers RO4350B + FR4 Hybrid

- Finished Thickness: 0.8mm

- Min Hole Size: 0.2mm

- Min Line Width / Space: 6mil / 6mil

- Surface Finish: ENIG (Electroless Nickel Immersion Gold)

- Flammability: UL94 V-0

- Impedance Control: Custom 50Ω RF microstrip impedance available

- Frequency Band: 2.4GHz, 5.8GHz

Product Advantages

1. Low Loss High Frequency Performance

Rogers 4350B features low Df, stable phase performance, minimal RF signal loss to guarantee reliable wireless transmission.

2. Cost-Effective Hybrid Stack-up

High-frequency material only on outer signal layers, FR4 for inner power/ground layers. Lower cost than full Rogers board without sacrificing RF performance.

3. Fine Line & Microvia Capability

Supports 6mil fine trace and 0.2mm micro holes. High-density routing with multi-layer ground planes for superior EMI shielding.

4. ENIG Surface Finish

Flat and smooth pad surface, excellent oxidation resistance, perfect for soldering RF IC and RF connectors in SMT assembly, long-term reliability.

5. Industrial Grade Reliability

UL94 V-0 flame retardant. Strict warpage control, 100% electrical test by flying probe and AOI inspection, stable performance for harsh industrial environment.

Application

Industrial RF, wireless data transmission module, industrial gateway RF board, automation wireless remote control, 2.4G /5.8G industrial sensor transceiver board, industrial wireless communication equipment.

Manufacturing Capability | Juehui Weiye Circuit

Juehui Weiye Circuit specializes in custom high-frequency & RF PCB fabrication. We master mature hybrid lamination technology for Rogers material, solving common problems like board warpage and delamination when pressing dissimilar materials.

✅ Pre-production DFM review & RF impedance simulation support

✅ Prototype, small batch & mass production available

✅ Full inspection: AOI optical inspection, flying probe electrical test, impedance sampling test

✅ Wide range high-frequency PCB: Rogers, Taconic, Panasonic material, 2~16 layers customizable