Multimedia Intelligent Mainboard PCBA

This is MQ-QCS430-T-A V2.0 Qualcomm platform multimedia intelligent mainboard PCBA, finished dimension 130mm × 125mm. The PCB is a 6-layer FR-4 high-TG black solder mask board, serving as a high-performance embedded core main control board.

It is equipped with Qualcomm QCS430 processor and Quectel FC66E 5G communication module, integrated with multiple network ports, USB3.0, MIPI display interface, audio interface and peripheral pin headers. It supports 5G communication, video encoding & decoding, multi-screen output and high-speed data transmission.

This PCBA features densely packed BGA/QFN high-density components, which impose strict requirements on PCB impedance control, precision SMT mounting, BGA soldering and X-Ray inspection.

Juehui Weiye Circuit provides one-stop customized PCBA services including PCB fabrication, BOM component sourcing, precision SMT assembly, DIP insertion, BGA soldering, X-Ray inspection, AOI optical inspection, ICT and firmware programming for finished products. We specialize in manufacturing high-end embedded intelligent mainboards, multimedia development boards and 5G IoT mainboards. We support B2B customers in industrial control, communication, medical, automotive electronics, intelligent IoT, security, robotics and AI hardware for rapid PCBA prototyping and mass production.

Basic Specifications

- Finished PCBA Dimension: 130mm × 125mm

- PCB Material: FR-4 high-TG multi-layer substrate

- PCB Layers: 6 layers

- Board Thickness: 1.6mm

- Solder Mask Color: Black

- Surface Finish: ENIG (Electroless Nickel Immersion Gold)

- Minimum Trace Width / Space: 0.1mm / 0.1mm

- Minimum Hole Size: 0.2mm

- Smallest SMT Package: 0201

- Precision Component Packages: BGA, QFN, QFP

- Core Chips: Qualcomm QCS430 Processor, Quectel FC66E 5G Module

- Interfaces: Dual Ethernet ports, multiple USB3.0, Type-C, MIPI display connector, audio terminal, multiple peripheral connectors

- Manufacturing Process: Precision SMT assembly + BGA reflow soldering + DIP through-hole assembly + manual post soldering

- Quality Standards: RoHS, ISO9001; ICT, AOI and X-Ray inspection available

Manufacturing Process

Process Flow: PCB fabrication → Bare-board AOI inspection → Precision SMT assembly (BGA, QFN, 0201 components, 10-zone lead-free reflow soldering) → Post-SMT AOI inspection → X-Ray inspection for BGA solder joints → DIP through-hole insertion → Wave soldering → Post-soldering touch-up → Secondary AOI inspection → ICT continuity test → Firmware programming & functional test → Finished board cleaning, final visual inspection, packaging & delivery

> Core Technical Challenges: BGA chip mounting, high-speed signal impedance control, 0201 tiny component placement, MIPI high-speed connector soldering. Juehui Weiye Circuit has full set of processing and inspection capabilities for high-density advanced boards.

Component List & Functions

1. Qualcomm QCS430 BGA Main Processor: Core SOC of the mainboard, responsible for OS operation, video codec, multimedia computation, peripheral scheduling and high-speed signal processing.

2. Quectel FC66E 5G Communication Module: 5G wireless communication unit, provides 5G/4G network access for high-speed wireless data transmission.

3. PMIC (Power Management IC, QFN package): Multi-channel step-down & voltage regulation, supplies stable power to main processor, memory, peripherals and 5G module, with integrated over-voltage, over-current and short-circuit protection.

4. DDR Memory IC (BGA): System running memory for temporary data caching to ensure high-speed computation.

5. eMMC Storage IC (BGA/QFN): Solid-state storage for operating system, applications and user data.

6. Ethernet PHY Chip: Ethernet physical layer chip for network signal transceiving and wired network driving.

7. USB Protection / Conversion IC: USB signal conversion and ESD protection, manages multiple USB ports.

8. Audio Codec Chip: Audio encoding & decoding for audio recording, speaker output and audio signal processing.

9. SMT Power Inductor (Shielded High Power Inductor): Energy storage for DC-DC power loop, cooperates with power IC for voltage conversion.

10. SMT Multilayer Ceramic Capacitor (0201/0402): Decoupling for chip power pins, filters high-frequency noise and stabilizes power supply.

11. Through-hole Aluminum Electrolytic Capacitor: Large-capacity energy storage, filters low-frequency power ripple and withstands instantaneous high current surge.

12. SMT Resistor (0201/0402): Voltage division, current limiting, pull-up / pull-down and current sampling.

13. TVS ESD Protection Diode: ESD & surge protection, protects USB, network and communication interfaces from pulse high voltage damage.

14. SMT Crystal Oscillator: Provides reference clock signal for main control, network and communication chips.

15. MIPI Display FPC Connector: High-speed display interface to connect display panel and output image signals.

16. RJ45 Ethernet Connector: Wired Ethernet access for high-speed wired network communication.

17. USB3.0 Female Socket, Type-C Port: Peripheral expansion, data transmission and power supply.

18. White PH Through-hole Terminal: External wiring for peripherals, sensors, speakers and power supply.

19. Buzzer: Audio alarm and status indication.

20. Reset / DIP Switch: Hardware reset, device address and function configuration.

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Application Fields

- Intelligent multimedia terminals, industrial HMI touch screens

- 5G IoT gateways, edge computing boxes

- Digital signage, self-service terminals, intelligent display equipment

- Automotive multimedia, security video acquisition devices

- Intelligent robot main control boards, AI vision processing terminals

Service Advantages of Juehui Weiye Circuit

Juehui Weiye Circuit has mature PCBA manufacturing capability for high-density BGA mainboards and multi-layer high-speed boards. We undertake orders of 5G mainboards, embedded core boards, multimedia intelligent mainboards and more PCBA:

Our one-stop services include Gerber DFM review, high-speed impedance calculation, PCB manufacturing, component sourcing, SMT for 01005 & 0201 miniature components, BGA mounting & soldering, X-Ray inspection, DIP insertion, post-soldering assembly, ICT functional test and firmware burning.

The company has obtained ISO9001 and ISO13485 medical quality management system certifications. Products comply with international environmental standards including REACH, RoHS and UL.

We support rapid low-volume prototyping, medium-volume pilot run and mass production. Customization is available for PCB layer count, board thickness, surface finish and impedance design, together with complete test solutions. B2B equipment manufacturers and solution companies are welcome to send drawings, BOM and centroid files for quotation and sample evaluation.

Order Instructions

Please provide PCB Gerber files, BOM list, centroid files and test specifications. We will offer one-stop quotation and production evaluation covering PCB fabrication, precision SMT (BGA), DIP insertion, post soldering and firmware programming.

Board material, thickness, PCB layers, surface finish and component selection can be customized as required.

📞 Tel: +86 189-2464-6170

📧 Email: szjhpcb@vip.126.com

🌐 Website: https://www.szjhpcba.com/