According to reports published by Taiwan-based Economic Daily News and Commercial Times in early August 2026, Hsiu-Lan Hsu, Chairperson of major semiconductor silicon wafer supplier GlobalWafers, stated during the latest earnings conference that global semiconductor market demand continues to rebound. Capacity utilization rates across GlobalWafers’ existing 12-inch, 8-inch and 6-inch silicon wafer production lines have risen sharply, with operations running nearly at full capacity.

Driven by the expansion of AI computing power, the recovery of automotive electronics, and rising demand for high-end logic chips, the company is engaged in negotiations with multiple leading global customers for new Long-Term Agreements (LTAs). Beyond memory chips, which have faced supply shortages, the scope of these new long-term supply contracts extends broadly to logic chips, advanced process nodes, and specialty silicon wafer segments.

Hsiu-Lan Hsu noted that the rapid ramp-up in utilization for all wafer sizes signals that inventory destocking across the semiconductor supply chain is drawing to an end, while downstream demand delivers robust structural growth.

For 12-inch wafers, explosive demand for AI servers, high-performance computing (HPC), and advanced packaging technologies (such as CoWoS) fuels extremely strong appetite for ultra-clean silicon wafers deployed in advanced manufacturing processes.

For 8-inch and 6-inch wafers, steady recovery in demand for automotive power semiconductors, power management ICs (PMICs), and industrial control applications has driven a better-than-expected overall rebound in capacity utilization, reversing the previously weak demand trend for medium and small-sized wafers.

Regarding fulfillment of existing LTAs and progress on new contract signings, GlobalWafers management disclosed that customers are highly proactive in securing guaranteed wafer supply.

Breaking from past patterns where memory manufacturers were the primary participants in long-term wafer procurement, this round of LTA negotiations sees strong willingness to sign agreements among major global logic foundries, IDM companies, and specialty-process chip design firms.

By locking in silicon wafer capacity for multiple years, customers aim to hedge against potential shortages of upstream critical materials triggered by the upcoming boom in AI end devices, 800V automotive platforms, and new energy connected vehicle systems over the next several years.