I. Industry

• PBOC releases Q2 Monetary Policy Implementation Report, stepping‑up counter‑cyclical adjustment

On August 12, the People’s Bank of China issued the China Monetary Policy Implementation Report for Q2 2026. China’s GDP grew 4.7% year‑on‑year in the first half of the year. At end‑June, the outstanding aggregate social financing and M2 rose 7.4% and 8.0% year‑on‑year respectively, and the average interest rate on newly‑granted corporate loans stood at approximately 3.0%. Going forward, a moderately accommodative monetary policy will continue to be implemented to maintain ample liquidity, strengthen counter‑cyclical adjustment, and bolster domestic demand expansion, sci‑tech innovation, as well as micro, small and medium‑sized enterprises. (People’s Bank of China)

• BRICS Industry Ministers’ Meeting adopts joint declaration to strengthen industrial‑chain and supply‑chain cooperation

On August 6, the 10th BRICS Industry Ministers’ Meeting convened in Jaipur, India. Participants exchanged views on topics including SMEs, photovoltaic industry transition, startup empowerment and logistics system development. The meeting adopted a joint declaration and approved documents such as the action plan for the PV Industry Working Group. The Chinese side proposed leveraging platforms including the China‑BRICS AI Development and Cooperation Center to foster secure, stable, unimpeded and efficient industrial and supply chains. (Ministry of Industry and Information Technology)

• U.S. July inflation shows moderate readings, easing Fed rate‑hike pressure

On August 13, the latest U.S. inflation data was released. Figures from the U.S. Bureau of Labor Statistics show that the unadjusted CPI in July slowed to 3.4% year‑on‑year, and core CPI eased to 2.5% year‑on‑year. Seasonally‑adjusted CPI rose 0.1% month‑on‑month, while core CPI increased 0.2% month‑on‑month, both in line with market expectations. Following the data release, traders’ expectations for a Fed rate hike in September remained broadly stable. (U.S. Bureau of Labor Statistics)

II. Market

• Memory price hikes push up handset costs; iPhone 18 Pro BOM cost projected to surge by 38%

On August 10, TrendForce stated that driven by price increases for memory and other components, the BOM cost of the 256GB iPhone 18 Pro is expected to rise by roughly 38% compared with the corresponding model of the prior year. Memory’s share of the Pro‑series BOM cost has climbed from around 10% one year ago to approximately 34%. Mid‑to‑low‑end Android handsets have thinner gross‑profit buffers; brands may respond via price increases, specification downgrades or phasing‑out low‑margin products. Global smartphone output remains subject to downward revision pressure from H2 2026 through 2027. (TrendForce)

• Global TV shipments largely flat in Q2; OLED TV shipments up 20% YoY

On August 7, Counterpoint Research published statistics. Global TV shipments fell 4% year‑on‑year in June 2026, while Q2 overall shipments edged down 0.4% year‑on‑year, essentially flat. Among them, OLED TV shipments grew 12% YoY in June and 20% YoY for Q2. Samsung and TCL captured 13.7% and 13.8% shipment shares respectively in the LCD TV market. Competition in MiniLED is intensifying, and cost reduction for WOLED is expected to boost OLED TV penetration. (Counterpoint Research)

• IDC: China tablet market shipments hit 7.96 million units in Q2, down 4.4% YoY

On August 13, International Data Corporation (IDC) released its China Tablet Market Quarterly Tracker Report for Q2 2026. Data shows China’s tablet market shipped 7.96 million units in Q2 2026, dropping 4.4% year‑on‑year, with the decline narrowing slightly versus Q1. Nevertheless, market pressure has not abated but intensified. Solid growth in the commercial segment mainly stemmed from front‑loaded demand amid price‑hike expectations. By contrast, the consumer market declined 9.8% YoY due to rising costs and advanced demand release. While headline market contraction appears smaller, cost inflation is accelerating its pass‑through to end‑user demand. (CLS.cn)

III. Enterprises

• Eaton Electronics to invest RMB 2.979 billion in high‑end PCB smart‑manufacturing project

On August 7, Eaton Electronics announced plans to invest RMB 2.979 billion using self‑owned and self‑raised funds to build a high‑end, high‑speed multi‑layer PCB smart‑manufacturing project within its existing industrial park in Zhongshan. The construction period will span 21 months. The product portfolio focuses on high‑multi‑layer boards and high‑order HDI boards for servers, high‑speed switches, routers, accelerator cards and computing‑power motherboards. On the same day, the firm unveiled a private placement proposal aiming to raise up to RMB 2.0 billion, of which RMB 1.85 billion will be allocated to this project. (Shanghai Stock Exchange)

• Kingboard Electronics’ high‑order HDI factory enters final installation and commissioning phase

On August 6, Kingboard Electronics disclosed that its high‑order HDI plant in Jinwan, Zhuhai has entered the final phase of interior renovation, equipment installation and commissioning. Upon full operation, it will add an annual capacity of 800,000 square meters of high‑order HDI boards. The Jinwan base has completed three mSAP production lines and supplies PCBs for 800G and 1.6T optical modules to leading global customers. (WIND)

• Jin’an Guoji to raise approximately RMB 1.3 billion for copper‑clad laminate project and R&D center

On August 12, Jin’an Guoji announced it has obtained the CSRC registration approval for its private share issuance, valid for 12 months. The company plans to raise no more than roughly RMB 1.3 billion to fund a 40‑million‑square‑meter high‑grade copper‑clad laminate project and R&D‑center construction, expand high‑grade CCL capacity, and advance R&D on high‑frequency high‑speed and high‑temperature‑resistant special copper‑clad laminates. (Jin’an Guoji corporate announcement)

• Huzheng New Materials plans RMB 1.0 billion private placement for high‑grade CCL capacity expansion

On August 6, Huzheng New Materials announced that its application for A‑share private placement has been accepted by the Shanghai Stock Exchange; it still needs SSE review and CSRC registration approval. The company intends to raise up to RMB 1.2 billion, among which RMB 1.0 billion will go toward a project for 12‑million‑sheet annual output of high‑grade copper‑clad laminates, and RMB 0.2 billion for working‑capital replenishment. The project targets high‑end applications including high‑speed communications, computing‑power infrastructure and semiconductor packaging. (Securities Times)

• Rongda Photosensitive proposes raising investment in Thailand subsidiary to USD 35 million

On August 12, Rongda Photosensitive released an announcement on increasing investment in its overseas subsidiary. It plans to lift the investment amount for its wholly‑owned subsidiary Rongda Photosensitive Technology (Thailand) Co., Ltd. from USD 7 million to USD 35 million. The revised investment aligns with the total investment of RMB 235.2907 million (including proposed raised funds of RMB 215.00 million plus self‑owned capital) for the Thailand manufacturing‑base project stated in its 2026 private placement proposal. (WIND)

• Sihui Rich Field updates private‑placement documents, plans to expand high‑multi‑layer and HDI PCB capacity

On August 6, Sihui Rich Field updated its private‑placement prospectus and replies to regulatory inquiries. It proposes raising up to RMB 0.93 billion, all to be invested in Phase‑I of the 600,000‑square‑meter annual‑output high‑multi‑layer & HDI PCB project, with total project investment of approximately RMB 1.092 billion. Targeting servers, smart terminals and optical modules, the project will add 600,000 square meters of annual capacity for high‑multi‑layer and HDI PCBs upon completion. (Sihui Rich Field corporate announcement)

• Guangyang Co., Ltd. acquires Changshu Southeast Mutual Electronics Co., Ltd.

On August 7, Guangyang Co., Ltd. completed industrial‑and‑commercial registration for the 100% equity acquisition of Changshu Southeast Mutual Electronics Co., Ltd., with transaction consideration of RMB 0.622 billion. This marks Southeast Mutual formally being consolidated into Guangyang’s financial statements, representing a key milestone in Guangyang’s strategic layout within the PCB sector. After registration completion, Guangyang holds 100% equity in Changshu Southeast Mutual Electronics Co., Ltd., which is included in the company’s consolidated financial statements. (WIND)