Multi-Channel Signal Acquisition Test Fixture PCBA

This PDAQ multi-channel signal acquisition test fixture PCBA, Board No. Sealing-FT-STB-H10-V1.0, has finished dimensions of 160mm × 132mm. It delivers one-stop processing including PCB fabrication, SMT assembly and connector mounting.

The board features a dual-channel test point matrix, equipped with high-density SMT inductors, resistor-capacitor networks and high-speed large-pitch connectors. Two independent test channels PDAQ-NO.1 and PDAQ-NO.2 form an extensive test point array. It is mainly used for sealing performance testing, electrical continuity testing and burn-in testing of semiconductor and electronic components. It can rapidly collect electrical parameters of DUTs in batches and is compatible with automated test systems, featuring high channel density, excellent signal consistency and long-term stability & durability.

The board uses FR-4 substrate with massive passive components arranged in matrix form. High-current high-speed connectors are mounted at the top and bottom to lead out multi-channel test ports. The large-area component array ensures synchronous multi-channel signal acquisition. Multiple mounting holes are reserved for fixture fixation on automated test benches. Neat component layout facilitates probe docking, delivering superior signal integrity and strong stability for long continuous burn-in tests.

Juehui Weiye Circuit offers full manufacturing capabilities for test fixture PCBA. We provide one-stop customization for test fixtures , high-density SMT assembly, connector mounting and channel continuity testing for low-to-medium volume orders.

Core Specifications

【Board Number】Sealing-FT-STB-H10-V1.0

【Product Name】PDAQ Multi-Channel Signal Acquisition Test Fixture PCBA (Finished Board: PCB+SMT+Connector Assembly)

【Finished Size】160mm × 132mm

【Substrate】FR-4

【Functional Architecture】Dual Independent Test Matrix (PDAQ-NO.1 / PDAQ-NO.2)

【Key Components】SMT Power Inductors, High-Precision SMT Resistors & Capacitors, High-Speed Board-to-Board Connectors

【Board Features】High-Density Point Array, Multi-Channel Parallel Signal Acquisition

【Mounting Method】Multiple Positioning Mounting Holes for Locking onto Automated Test Benches

【Flame Retardant Grade】UL94 V-0

【PCBA Process Flow】PCB Fabrication + High-Density SMT Assembly + Connector Assembly + Dry Ice Cleaning + Full-Channel Continuity Test

PCBA Assembly Process

1. SMT Assembly

- Fully automatic solder paste printing with SPI solder paste thickness inspection;

- High-speed placement machine for mass mounting of SMT power inductors and 0402/0603 SMT resistors & capacitors. The huge component array demands high placement precision and consistency;

- 10-zone lead-free reflow soldering with optimized temperature profile to reduce thermal deformation of large-area PCBs;

- Automatic AOI optical inspection to check component offset, tombstoning, cold joints and insufficient solder at every point.

2. Connector Assembly

- Mount and solder high-speed large-pin connectors on the board to guarantee reliable pin soldering;

- 100% flatness inspection of connector pins after soldering to ensure durability for repeated mating and unmating.

3. Post-Processing

- Board cleaning to remove flux residue and prevent electric leakage and signal drift during long-duration testing;

- Full-channel continuity test to verify each path of the test matrix point by point;

- 100% visual inspection, dimensional inspection and connector mating test;

- ESD vacuum packaging.

> Assembly Highlights: High-density placement of an extremely large quantity of passive components with evenly distributed arrays. PCB thermal warpage is strictly controlled to maintain consistent electrical parameters across all channels. Connectors are firmly soldered to sustain repeated plugging, suitable for long-hour automated production-line testing.

Product Advantages

1. **High-Density Multi-Channel Test Ports**: Matrix layout with abundant test points and dual independent zones enables simultaneous mass signal collection from DUTs, greatly improving production-line automated test efficiency.

2. **Excellent Signal Consistency**: Standardized BOM and SMT process control tightly restrict parameter deviation of each RC loop. Stable signals during multi-channel parallel acquisition reduce false test judgments.

3. **High Fixture Compatibility**: Multiple reserved positioning holes and regular board outline allow direct locking on automated test benches. High-speed board-to-board connectors realize fast connection with upper acquisition equipment for easy integration.

4. **Durable Anti-Burn-In Process**: Flux residue removed by board cleaning. Industrial-grade passive components are selected to support 7×24-hour continuous burn-in and sealing performance testing in factories with minimal signal drift over long operation.

5. **One-Stop Custom PCBA Service**: Juehui Circuit covers the full workflow from PCB fabrication, component procurement, high-density SMT assembly to finished full-channel testing. Fast prototyping and low/medium volume production help customers shorten test fixture development cycles.

6. **Pre-emptive DFM Evaluation**: Assess PCB thermal deformation risks in advance for high-density component arrays. Optimize component layout and stencil apertures to prevent tombstoning and cold joints in large-area SMT assembly.

Application Fields

Semiconductor device sealing performance test fixtures, electronic component burn-in bench PCBA, multi-channel DUT signal acquisition boards, automated production-line functional test jigs, batch sensor inspection equipment, component continuity/insulation test fixtures, industrial automated ATE test platforms.

Manufacturing Capabilities of Juehui Circuit

Juehui Circuit specializes in various test fixtures, ATE acquisition boards, industrial control PCBs and PCBA services ([https://www.szjhpcba.com/pcba.html](https://www.szjhpcba.com/pcba.html)). We excel at high-density matrix SMT, mass RC component placement, connector assembly and full-channel testing for fixture boards.

✅ Capable of large-area high-density array SMT assembly. Experienced in one-time mounting of massive passive components with strict control over board warpage and component consistency.

✅ Conduct DFM design review, evaluate thermal deformation risks for large copper areas and component arrays, and optimize stencil and reflow processes.

✅ Full-process quality control: SPI solder paste inspection, AOI optical inspection, finished full-channel continuity test and dimensional verification to ensure parameter consistency across multi-channels.

✅ Service Model: One-stop service including PCB prototyping, SMT assembly, connector mounting, component procurement and finished PCBA functional testing. Support fast test-fixture prototyping and stable delivery for low/medium-volume orders to cooperate with customer production verification.

Order Instructions

Please provide PCB Gerber files, BOM list, component centroid files and test specifications. We will deliver one-stop quotation and manufacturing evaluation covering PCB production, SMT assembly and connector assembly. Substrate material, board thickness, surface finish and component sourcing schemes can be adjusted upon request.

📞 Tel: +86 189-2464-6170

📧 E-mail: szjhpcb@vip.126.com

🌐 Official Website: https://www.szjhpcba.com