Recently, the Shanghai Municipal People's Government officially issued the "15th Five-Year Plan for Accelerating New-Type Industrialization and Building a Modern Industrial System in Shanghai" (hereinafter referred to as the "15th Five-Year Plan"). The Plan explicitly identifies integrated circuits, biomedicine, and artificial intelligence as three pioneering industries, and proposes to build three new trillion-yuan industrial clusters in integrated circuits, biomedicine, and AI — marking a comprehensive acceleration of Shanghai's strategic layout in semiconductors and electronic information.

I. Policy Core: Full-Chain Breakthrough to Build a World-Class IC Industrial Cluster

The "15th Five-Year Plan" makes systematic arrangements for the integrated circuit industry, with key points including:

•Full-chain R&D: Pursue full-chain breakthrough and cluster advancement, focusing on Zhangjiang, Lingang, and Jiading core areas to build a "one body, two wings" world-class industrial cluster;

•High-end Design Leadership: Promote the high-end development of EDA and IP cores, vigorously cultivate industry leaders, and advance high-performance computing chips, general-purpose processor chips, memory chips, interconnection chips, and smart sensors to internationally advanced levels;

•Manufacturing & Packaging Upgrade: Accelerate major production line projects, drive faster process iteration and capacity expansion, strengthen specialty processes, and speed up the industrialization of advanced packaging technologies;

•Equipment, Materials & Components Enhancement: Accelerate systematic and platform-based development to upgrade technical capabilities in key links.

Meanwhile, the Plan prioritizes AI servers, 5G-A/6G communications, satellite communications, and high-precision sensors in the new-generation electronic information sector; in AI, it emphasizes intelligent computing chips, heterogeneous computing, and urban computing power network construction. All these directions resonate strongly with the demand for high-end PCB/PCBA manufacturing.

II. Industry Opportunities: High-End PCB and PCBA Manufacturing as Key Supply-Chain Support

The full-chain breakthrough of the IC industry cannot be achieved without the coordinated support of upstream high-end Printed Circuit Board (PCB) and Surface Mount Technology (SMT/PCBA) manufacturing capabilities. With the accelerated development of computing chips, AI servers, 5G-A/6G communications, automotive electronics, and aviation navigation, the market is imposing higher requirements on PCB layer count, precision, specialty processes, and fast low-to-medium volume delivery:

•High-Layer Count & HDI Technology: Demand for high-layer count and HDI boards continues to grow in AI high-speed servers, communication base stations, and similar applications;

•Heavy Copper & Special Surface Finishing: Strong demand for heavy copper boards and special surface finishing in power modules, automotive electronics, and industrial control;

•Ultra-Thin & High-Frequency High-Speed Materials: Growing reliance on ultra-thin boards and high-frequency high-speed substrates in 5G/6G communications, satellite communications, and aviation navigation;

•Low-to-Medium Volume Customization: Significantly increased demand for multi-variety, low-to-medium volume, fast-delivery PCBA services in R&D verification, medical devices, and defense communications.

III. Juhui Weiye: Deeply Rooted in High-End PCBA Manufacturing, Precisely Aligned with Industry Upgrade Needs

As a professional service provider focused on low-to-medium volume high-end PCBA custom manufacturing, Juhui Weiye has long concentrated on high-end sectors including medical devices, defense communications, 5G communications, AI high-speed servers, automotive TBOX/ECALL, and aviation navigation. Our core manufacturing capabilities are highly aligned with the key directions of Shanghai's "15th Five-Year Plan."

We offer one-stop services spanning PCB manufacturing, SMT assembly, and full-turnkey PCBA delivery. Our SMT assembly capabilities support high-precision micro-component placement including 01005, 0201, BGA, and QFN packages. We can rapidly respond to diverse customer needs across R&D verification, low-volume pilot production, and mass production stages, providing reliable manufacturing support for downstream IC application enterprises.

IV. Outlook: Riding the Policy Tailwind, Continuously Strengthening High-End Manufacturing Capabilities

The release of Shanghai's "15th Five-Year Plan" outlines a clear development blueprint for the IC and electronic information industries, and brings vast market opportunities for high-end PCB/PCBA manufacturers. Juhui Weiye will continue to focus on high-end sectors, continuously upgrading core process capabilities including high-layer count HDI, heavy copper, ultra-thin boards, and special surface finishing, and optimizing our low-to-medium volume customized delivery system. With more professional manufacturing services, we will contribute to the coordinated development of the IC supply chain and support Shanghai in building a world-class integrated circuit industrial cluster from the manufacturing side.