Shenzhen Juehui Weiye Circuit Co., Ltd. is a one-stop integrated service provider specializing in PCB and PCBA manufacturing. Our core services include high-precision multilayer PCB production (https://www.szjhpcba.com/pcb.html), customized AI computing-power circuit boards, rapid PCB prototyping, PCBA assembly and full-turnkey testing(https://www.szjhpcba.com/pcba.html).

Equipped with high-end precision production equipment, we support ultra-high-density packaging processes. Our products are widely applied in AI computing infrastructure, communication equipment, new energy vehicles, smart home appliances, industrial control, medical electronics and high-end consumer electronics. Supported by a mature supply chain and strict quality control system, we deliver high-quality, high-efficiency electronic circuit manufacturing solutions for global customers.

We focus on the industrial chains of PCB, electronic manufacturing, foreign trade and AI computing power. We compile weekly core industry developments and interpret industry trends and market opportunities based on our business layout.

I. Industry Policies

General Secretary Xi Jinping issues important instructions on developing advanced manufacturing

On September 17, General Secretary Xi Jinping delivered important instructions on developing advanced manufacturing. He stressed promoting high-end, intelligent and green development of manufacturing, advancing deep integration of scientific and technological innovation with industrial innovation, and strengthening the resilience and security of industrial and supply chains. The electronic information manufacturing sector will further advance toward digitalization, networking and intelligence.

Source: Xinhua News Agency

FDI in high-tech industries rises 35.1% in the first 8 months

On September 18, the Ministry of Commerce released data. In the first eight months, China registered 42,582 newly established foreign-invested enterprises, up 0.3% year-on-year; actual utilized foreign capital reached RMB 479.95 billion. FDI inflow into high-tech industries hit RMB 200.26 billion, surging 35.1% YoY, among which investment in electronic and communication equipment manufacturing jumped 41.9%.

Source: Ministry of Commerce of the People’s Republic of China

China-U.S. economic and trade consultations held in New York with dialogue on artificial intelligence

On September 20, Chinese and U.S. economic and trade teams held consultations in New York. Both sides exchanged views on implementing the important consensus reached in the heads-of-state phone call and deepening economic, trade and investment cooperation, and held in-depth dialogues on artificial intelligence and other topics. The two sides agreed to maintain regular communication to stabilize market expectations for enterprises and create favorable conditions for cross-border industrial cooperation.

Source: Ministry of Commerce

II. Market Dynamics

Tight HBM4 supply leads TrendForce to raise 2027 HBM price forecast

On September 22, TrendForce pointed out that driven by robust AI demand, tight supply of HBM4 and product structure upgrading, the market outlook for HBM prices in 2027 has been revised upward. 8-stack products will remain the mainstream shipment type. Upgrades in high-bandwidth memory will continuously boost demand for advanced packaging and high-end substrates.

Source: TrendForce

Smart glasses sales on major platforms surge 120% in the first 8 months

On September 21, Ministry of Commerce data showed that total retail sales of consumer goods and service retail sales both rose 2.5% year-on-year in the first eight months. Sales of communication equipment on key platforms grew by 16.3%, while sales of smart glasses jumped 120%. New forms of consumer electronics maintained rapid growth, and AI wearable devices are gaining market penetration at an accelerated pace.

Source: Ministry of Commerce

Online mobile phone retail sales rise 6.8% in the first 8 months

On September 21, the Ministry of Commerce released e-commerce performance data. Online retail sales of goods and services increased by 4.6% YoY in the first eight months. Online mobile phone retail sales grew by 6.8%, while instant retail maintained double-digit growth. Online channels are playing an increasingly important role in promoting new consumer electronics launches and unleashing market demand.

Source: Ministry of Commerce

Global home cleaning robot shipments surge over 25% in H1 2026

On September 22, IDC released a report showing global shipments of home cleaning robots rose more than 25% year-on-year in the first half of 2026, with lawn mowing robots growing by 76%. IDC forecasts that global home cleaning robot shipments will reach approximately 54 million units by 2030, with steady expansion of smart home terminal demand.

Source: IDC

III. Corporate News

Chongda Technology’s subsidiary advances end-side functional IC packaging substrate project

On September 17, Chongda Technology announced that its holding subsidiary Punuowei has won the bid for two land parcels in Qiandeng Town, Kunshan and signed land transfer contracts for state-owned construction land. The industrial land covers around 23.41 mu, which will be used to build the end-side functional IC packaging substrate project, improving the company’s high-end packaging substrate capacity layout.

Source: Wind Information

Yibo Technology advances Phase II Zhuhai plant and launches mSAP production line equipment procurement

On September 17, Yibo Technology stated during investor communications that interior decoration and equipment procurement for Phase II of its Zhuhai PCB factory are proceeding as scheduled. After full capacity release of Phase I and Phase II, the annual production capacity is expected to reach RMB 2.5–3 billion. Equipment selection for the mSAP (Modified Semi-Additive Process) production line has been completed, and relevant equipment is now being purchased.

Source: Yibo Technology Announcement

Shengyi Electronics completes registration for new shares from RMB 2.529 billion private placement

On September 19, Shengyi Electronics disclosed the results of its private placement. A total of 22.6698 million new shares were registered on September 17. The total raised capital reached RMB 2.529 billion (net proceeds: RMB 2.52 billion), which will fund the AI computing HDI production base and intelligent manufacturing high-layer computing-power PCB projects.

Source: Securities Times

Board suppliers raise prices again; Jialichuang adjusts PCB quotations accordingly

On September 21, Jialichuang issued a notice. Affected by fluctuations in copper prices and upstream raw material costs, laminate suppliers raised prices once again. The company has updated its PCB quotations in line with the latest material costs. Price hikes of upstream copper clad laminates keep passing down to PCB manufacturers, raising new requirements for cost control and delivery guarantee across the industry.

Source: Jialichuang

Aoshikang plans RMB 1.82 billion investment for high-end PCB project in Zhaoqing

On September 22, during the online roadshow for its convertible bonds, Aoshikang disclosed that the total investment of its high-end printed circuit board project in Zhaoqing will reach RMB 1.82 billion. The company plans to raise RMB 1 billion via fundraising, with the remaining RMB 820 million covered by internal funds or self-raised capital. Investment will be arranged flexibly according to project progress and actual capital needs.

Source: [Cls.cn](https://Cls.cn)

Shi Yun Circuit’s Thailand plant enters mass production ramp-up phase

On September 22, Shi Yun Circuit shared updates at investor meetings. Its Thailand factory has entered the mass production ramp-up stage and passed certification from several core customers. Initial orders focus on automotive electronic PCBs for overseas clients. The company is also pushing forward customer qualification and order acquisition in energy storage and artificial intelligence sectors.

Source: Shi Yun Circuit Announcement

BW Storage plans RMB 4.5 billion investment to expand wafer-level advanced packaging & testing project

On September 22, BW Storage announced plans to launch Phase III of its wafer-level advanced packaging and testing project with total investment of approximately RMB 4.5 billion, including fixed-asset investment of RMB 4 billion. The completed Phase I and Phase II projects have a planned investment of RMB 3.09 billion and a monthly capacity of roughly 3,000 wafers, currently in sampling, process verification and small-batch trial production.

Source: BW Storage Announcement

>

> Disclaimer: This newsletter is compiled from public media and listed company announcements for industry reference only, and does not constitute any investment advice.