Client Cases

Capacitive Touch Key FPC SMT Assembly

• Black PI coverlay
• ENIG gold fingers
• 4-channel sensing pads in 2×2 array
• On-tail touch IC SMT available on request

Process Steps

FPC Fabrication + Connector SMT / Soldering

Custom FPC Sensor Module PCBA Assembly

• PCB Dimension: 40mm×25mm
• Minimum Trace Width / Spacing: 0.08mm / 0.08mm
• Minimum Hole Size: 0.1mm
• Component Packages: 0402 resistors

Process Steps

FPC Fabrication + SMT Assembly

Outdoor AI Network Camera Mainboard PCBA

• PCB Dimension: 195*195mm
• Component Count: 3500 Points
• Component Types: 181
• Minimum Component Package: BGA / 0201
• Minimum Pin Pitch: 0.3mm
• Soldering Method: 10‑zone Reflow Soldering + Wave Soldering

Process Steps

PCB Fabrication + SMT Assembly + DIP Through‑hole Insertion + Wave Soldering + Post‑soldering

Edge Computing AI Server Motherboard PCBA Contract Manufacturing

• PCB Dimension: 150*110mm
• Component Count: 5165
• Component Types: 172
• Minimum Package: BGA / 0201
• Minimum Lead Pitch: 0.35mm
• Soldering Process: 10-Zone Nitrogen Reflow Soldering + Dual Wave Soldering

Process Steps

PCB Fabrication, Double-sided SMT Assembly, Full AOI/X-Ray Inspection, Dry Ice Cleaning & Testing

AI Vision Linux Embedded Core Board PCBA Contract Manufacturing

• PCB Dimension: 140*71mm
• Component Count: 1125
• Component Types: 147
• Minimum Package: BGA / 01005
• Minimum Lead Pitch: 0.35mm
• Soldering Process: Double-sided SMT Nitrogen Reflow Soldering + Lead-free Wave Soldering

Process Steps

SMT Assembly, Full X-Ray Inspection & Dry Ice Cleaning

Custom PCBA Fabrication for Smart Instrument Main Control Boards

• PCB Dimensions: 170 × 101 mm
• Component Count: 826
• Component Types: 23
• Smallest Package: 0402
• Minimum Pin Pitch: 0.5 mm QFP
• Soldering Process: Double-sided Reflow Soldering + THT Wave Soldering

Process Steps

Double-sided SMT Assembly, Cleaning & ESD Packaging

Custom SMT Assembly PCBA for Digital Signal Expansion Modules

• PCB Dimensions: 134 × 80 mm
• Component Count: 326
• Component Types: 5
• Smallest Package: 2.5 mm
• Minimum Pin Pitch: 2.54 mm
• Soldering Process: Through-hole Assembly with Dual Wave Soldering

Process Steps

Wave Soldering (Dual Wave) + AOI Inspection + Cleaning